Dhananjay M. BHUSARI

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North Hills, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Upright photovoltaic cell with front contacts
- Patent number 12,245,444
- Issue date Mar 4, 2025
- The Boeing Company
- Philip T. Chiu
Information Patent Grant
Broadband antireflection coatings under coverglass using ion gun as...
- Patent number 10,115,843
- Issue date Oct 30, 2018
- The Boeing Company
- Philip Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct wafer bonding
- Patent number 9,564,548
- Issue date Feb 7, 2017
- The Boeing Company
- Dhananjay M. Bhusari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directly bonded, lattice-mismatched semiconductor device
- Patent number 9,331,227
- Issue date May 3, 2016
- The Boeing Company
- Daniel C. Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct wafer bonding
- Patent number 8,822,817
- Issue date Sep 2, 2014
- The Boeing Company
- Dhananjay M. Bhusari
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
UPRIGHT PHOTOVOLTAIC CELL WITH FRONT CONTACTS
- Publication number 20230335653
- Publication date Oct 19, 2023
- The Boeing Company
- Philip T. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROADBAND ANTIREFLECTION COATINGS UNDER COVERGLASS USING ION GUN AS...
- Publication number 20170062629
- Publication date Mar 2, 2017
- The Boeing Company
- Philip CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROADBAND ANTIREFLECTION COATINGS UNDER COVERGLASS USING ION GUN AS...
- Publication number 20160087114
- Publication date Mar 24, 2016
- The Boeing Company
- Philip CHIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIRECTLY BONDED, LATTICE-MISMATCHED SEMICONDUCTOR DEVICE
- Publication number 20150200321
- Publication date Jul 16, 2015
- The Boeing Company
- Daniel C. Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT WAFER BONDING
- Publication number 20140352787
- Publication date Dec 4, 2014
- Dhananjay M. Bhusari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT WAFER BONDING
- Publication number 20120138116
- Publication date Jun 7, 2012
- The Boeing Company
- Dhananjay M. BHUSARI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...