Dheeraj R. Subbareddy

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Network-on-chip (NOC) with flexible data width
- Patent number 12,237,831
- Issue date Feb 25, 2025
- Intel Corporation
- Sharath Raghava
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Programmable logic device with fine-grained disaggregation
- Patent number 12,206,410
- Issue date Jan 21, 2025
- Intel Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular periphery tile for integrated circuit device
- Patent number 12,153,866
- Issue date Nov 26, 2024
- Altera Corporation
- Chee Hak Teh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 12,026,008
- Issue date Jul 2, 2024
- Altera Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low-latency optical connection for CXL for a server CPU
- Patent number 12,007,929
- Issue date Jun 11, 2024
- Altera Corporation
- Anshuman Thakur
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical and optical interfaces at different heights along an edg...
- Patent number 11,983,135
- Issue date May 14, 2024
- Intel Corporation
- Dheeraj Subbareddy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Innovative interconnect design for package architecture to improve...
- Patent number 11,929,339
- Issue date Mar 12, 2024
- Intel Corporation
- Md Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronics assembly including top and bottom packages in stac...
- Patent number 11,915,996
- Issue date Feb 27, 2024
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple dies hardware processors and methods
- Patent number 11,899,615
- Issue date Feb 13, 2024
- Intel Corporation
- Nevine Nassif
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect architecture with silicon interposer and EMIB
- Patent number 11,901,299
- Issue date Feb 13, 2024
- Intel Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-die communication of programmable logic devices
- Patent number 11,789,883
- Issue date Oct 17, 2023
- Intel Corporation
- Sharath Raghava
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Modular periphery tile for integrated circuit device
- Patent number 11,714,941
- Issue date Aug 1, 2023
- Intel Corporation
- Chee Hak Teh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Network-on-chip (NOC) with flexible data width
- Patent number 11,700,002
- Issue date Jul 11, 2023
- Intel Corporation
- Sharath Raghava
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Frequency translation circuitry for an interconnection in an active...
- Patent number 11,669,472
- Issue date Jun 6, 2023
- Intel Corporation
- Lai Guan Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Innovative interconnect design for package architecture to improve...
- Patent number 11,658,144
- Issue date May 23, 2023
- Intel Corporation
- Md Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-speed core interconnect for multi-die programmable logic devices
- Patent number 11,621,713
- Issue date Apr 4, 2023
- Intel Corporation
- Lai Guan Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
On-die aging measurements for dynamic timing modeling
- Patent number 11,609,262
- Issue date Mar 21, 2023
- Intel Corporation
- Dheeraj Subbareddy
- G01 - MEASURING TESTING
Information Patent Grant
Connectivity between integrated circuit dice in a multi-chip package
- Patent number 11,610,856
- Issue date Mar 21, 2023
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable logic device with fine-grained disaggregation
- Patent number 11,595,045
- Issue date Feb 28, 2023
- Intel Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple dies hardware processors and methods
- Patent number 11,586,579
- Issue date Feb 21, 2023
- Intel Corporation
- Nevine Nassif
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect architecture with silicon interposer and EMIB
- Patent number 11,557,541
- Issue date Jan 17, 2023
- Intel Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to synchronize clocks of configurable integrated circuit...
- Patent number 11,528,029
- Issue date Dec 13, 2022
- Intel Corporation
- Lai Guan Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 11,500,412
- Issue date Nov 15, 2022
- Intel Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Innovative way to design silicon to overcome reticle limit
- Patent number 11,476,185
- Issue date Oct 18, 2022
- Intel Corporation
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for handling integrated circuit dies with defects
- Patent number 11,368,158
- Issue date Jun 21, 2022
- Intel Corporation
- Dheeraj Subbareddy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Network-on-chip (NOC) with flexible data width
- Patent number 11,342,918
- Issue date May 24, 2022
- Intel Corporation
- Sharath Raghava
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Rotatable architecture for multi-chip package (MCP)
- Patent number 11,342,238
- Issue date May 24, 2022
- Intel Corporation
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple dies hardware processors and methods
- Patent number 11,294,852
- Issue date Apr 5, 2022
- Intel Corporation
- Nevine Nassif
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Translation circuitry for an interconnection in an active interpose...
- Patent number 11,216,397
- Issue date Jan 4, 2022
- Intel Corporation
- Lai Guan Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Network-on-chip (NOC) with flexible data width
- Patent number 11,206,024
- Issue date Dec 21, 2021
- Intel Corporation
- Sharath Raghava
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
MODULAR PERIPHERY TILE FOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250077753
- Publication date Mar 6, 2025
- Altera Corporation
- Chee Hak Teh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Innovative Interconnect Design for Package Architecture to Improve...
- Publication number 20240213201
- Publication date Jun 27, 2024
- Intel Corporation
- MD Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
- Publication number 20240145395
- Publication date May 2, 2024
- Intel Corporation
- MD Altaf HOSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-DIE COMMUNICATION OF PROGRAMMABLE LOGIC DEVICES
- Publication number 20240028544
- Publication date Jan 25, 2024
- Intel Corporation
- Sharath Raghava
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Network-on-Chip (NOC) with Flexible Data Width
- Publication number 20230370068
- Publication date Nov 16, 2023
- Intel Corporation
- Sharath Raghava
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Innovative Interconnect Design for Package Architecture to Improve...
- Publication number 20230352431
- Publication date Nov 2, 2023
- Intel Corporation
- MD Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULAR PERIPHERY TILE FOR INTEGRATED CIRCUIT DEVICE
- Publication number 20230306173
- Publication date Sep 28, 2023
- Intel Corporation
- Chee Hak Teh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROGRAMMABLE LOGIC DEVICE WITH FINE-GRAINED DISAGGREGATION
- Publication number 20230198526
- Publication date Jun 22, 2023
- Intel Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIES HARDWARE PROCESSORS AND METHODS
- Publication number 20230169032
- Publication date Jun 1, 2023
- Intel Corporation
- NEVINE NASSIF
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
On-Die Aging Measurements for Dynamic Timing Modeling
- Publication number 20230129176
- Publication date Apr 27, 2023
- Intel Corporation
- Dheeraj Subbareddy
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
- Publication number 20230107106
- Publication date Apr 6, 2023
- Intel Corporation
- MD Altaf HOSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Clock Signal Transmission In Integrated Circuits And...
- Publication number 20230049681
- Publication date Feb 16, 2023
- Intel Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULAR PERIPHERY TILE FOR INTEGRATED CIRCUIT DEVICE
- Publication number 20220198115
- Publication date Jun 23, 2022
- Intel Corporation
- Chee Hak Teh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dynamically Scalable Timing and Power Models for Programmable Logic...
- Publication number 20220116042
- Publication date Apr 14, 2022
- Intel Corporation
- Atul Maheshwari
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEGMENTED ROW REPAIR FOR PROGRAMMABLE LOGIC DEVICES
- Publication number 20220113350
- Publication date Apr 14, 2022
- Intel Corporation
- Dheeraj Subbareddy
- G01 - MEASURING TESTING
Information Patent Application
LOW-LATENCY OPTICAL CONNECTION FOR CXL FOR A SERVER CPU
- Publication number 20220114125
- Publication date Apr 14, 2022
- Intel Corporation
- Anshuman THAKUR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SWITCH BASED ON LOAD CURRENT
- Publication number 20220115959
- Publication date Apr 14, 2022
- Intel Corporation
- MD Altaf Hossain
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Power Management using Voltage Islands on Programmable Logic Devices
- Publication number 20220116041
- Publication date Apr 14, 2022
- Mahesh K. Kumashikar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
NETWORK-ON-CHIP (NOC) WITH FLEXIBLE DATA WIDTH
- Publication number 20220116044
- Publication date Apr 14, 2022
- Intel Corporation
- Sharath Raghava
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRICAL AND OPTICAL INTERFACES AT DIFFERENT HEIGHTS ALONG AN EDG...
- Publication number 20220100692
- Publication date Mar 31, 2022
- Intel Corporation
- Dheeraj SUBBAREDDY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELECTIVE USE OF DIFFERENT ADVANCED INTERFACE BUS WITH ELECTRONIC C...
- Publication number 20220102281
- Publication date Mar 31, 2022
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF-PACKAGE HIGH DENSITY, HIGH BANDWIDTH MEMORY ACCESS USING OPTICA...
- Publication number 20220092016
- Publication date Mar 24, 2022
- Intel Corporation
- Mahesh K. KUMASHIKAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSLATION CIRCUITRY FOR AN INTERCONNECTION IN A SEMICONDUCTOR PAC...
- Publication number 20220092009
- Publication date Mar 24, 2022
- Intel Corporation
- Lai Guan Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHARACTERIZING DATA TRANSMITTED OVER AN OPTICAL LINK BASED ON ONE O...
- Publication number 20220094434
- Publication date Mar 24, 2022
- Intel Corporation
- Dheeraj SUBBAREDDY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Innovative Interconnect Design for Package Architecture to Improve...
- Publication number 20220059491
- Publication date Feb 24, 2022
- Intel Corporation
- MD Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIPLE DIES HARDWARE PROCESSORS AND METHODS
- Publication number 20220050805
- Publication date Feb 17, 2022
- Intel Corporation
- NEVINE NASSIF
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Embedded Programmable Logic Device for Acceleration in Deep Learnin...
- Publication number 20220044123
- Publication date Feb 10, 2022
- Rajesh Vivekanandham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Homogenous Die Stacking With Increased Element Density
- Publication number 20220013488
- Publication date Jan 13, 2022
- Mahesh K. Kumashikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INSTRUCTION SET ARCHITECTURE SUPPORTING VARYING FREQUENCIES
- Publication number 20220011811
- Publication date Jan 13, 2022
- Intel Corporation
- Dheeraj Subbareddy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Three-Dimensional Stacked Programmable Logic Fabric and Processor D...
- Publication number 20220014202
- Publication date Jan 13, 2022
- Rahul Pal
- G06 - COMPUTING CALCULATING COUNTING

Dheeraj R. Subbareddy

Person

Patents Grantslast 30 patents

Network-on-chip (NOC) with flexible data width

Programmable logic device with fine-grained disaggregation

Modular periphery tile for integrated circuit device

Techniques for clock signal transmission in integrated circuits and...

Low-latency optical connection for CXL for a server CPU

Electrical and optical interfaces at different heights along an edg...

Innovative interconnect design for package architecture to improve...

Microelectronics assembly including top and bottom packages in stac...

Multiple dies hardware processors and methods

Interconnect architecture with silicon interposer and EMIB

Inter-die communication of programmable logic devices

Modular periphery tile for integrated circuit device

Network-on-chip (NOC) with flexible data width

Frequency translation circuitry for an interconnection in an active...

Innovative interconnect design for package architecture to improve...

High-speed core interconnect for multi-die programmable logic devices

On-die aging measurements for dynamic timing modeling

Connectivity between integrated circuit dice in a multi-chip package

Programmable logic device with fine-grained disaggregation

Multiple dies hardware processors and methods

Interconnect architecture with silicon interposer and EMIB

Apparatus to synchronize clocks of configurable integrated circuit...

Techniques for clock signal transmission in integrated circuits and...

Innovative way to design silicon to overcome reticle limit

Methods for handling integrated circuit dies with defects

Network-on-chip (NOC) with flexible data width

Rotatable architecture for multi-chip package (MCP)

Multiple dies hardware processors and methods

Translation circuitry for an interconnection in an active interpose...

Network-on-chip (NOC) with flexible data width

Patents Applicationslast 30 patents

MODULAR PERIPHERY TILE FOR INTEGRATED CIRCUIT DEVICE

Innovative Interconnect Design for Package Architecture to Improve...

INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB

INTER-DIE COMMUNICATION OF PROGRAMMABLE LOGIC DEVICES

Network-on-Chip (NOC) with Flexible Data Width

Innovative Interconnect Design for Package Architecture to Improve...

MODULAR PERIPHERY TILE FOR INTEGRATED CIRCUIT DEVICE

PROGRAMMABLE LOGIC DEVICE WITH FINE-GRAINED DISAGGREGATION

MULTIPLE DIES HARDWARE PROCESSORS AND METHODS

On-Die Aging Measurements for Dynamic Timing Modeling

INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB

Techniques For Clock Signal Transmission In Integrated Circuits And...

MODULAR PERIPHERY TILE FOR INTEGRATED CIRCUIT DEVICE

Dynamically Scalable Timing and Power Models for Programmable Logic...

SEGMENTED ROW REPAIR FOR PROGRAMMABLE LOGIC DEVICES

LOW-LATENCY OPTICAL CONNECTION FOR CXL FOR A SERVER CPU

SWITCH BASED ON LOAD CURRENT

Power Management using Voltage Islands on Programmable Logic Devices

NETWORK-ON-CHIP (NOC) WITH FLEXIBLE DATA WIDTH

ELECTRICAL AND OPTICAL INTERFACES AT DIFFERENT HEIGHTS ALONG AN EDG...

SELECTIVE USE OF DIFFERENT ADVANCED INTERFACE BUS WITH ELECTRONIC C...

OFF-PACKAGE HIGH DENSITY, HIGH BANDWIDTH MEMORY ACCESS USING OPTICA...

TRANSLATION CIRCUITRY FOR AN INTERCONNECTION IN A SEMICONDUCTOR PAC...

CHARACTERIZING DATA TRANSMITTED OVER AN OPTICAL LINK BASED ON ONE O...

Innovative Interconnect Design for Package Architecture to Improve...

MULTIPLE DIES HARDWARE PROCESSORS AND METHODS

Embedded Programmable Logic Device for Acceleration in Deep Learnin...

Homogenous Die Stacking With Increased Element Density

FLEXIBLE INSTRUCTION SET ARCHITECTURE SUPPORTING VARYING FREQUENCIES

Three-Dimensional Stacked Programmable Logic Fabric and Processor D...