Dhishan Kande

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film resistor with punch-through vias
- Patent number 11,848,268
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor with punch-through vias
- Patent number 11,101,212
- Issue date Aug 24, 2021
- Texas Instruments Incorporated
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor and top plate of capacitor sharing a layer
- Patent number 10,840,322
- Issue date Nov 17, 2020
- Texas Instruments Incorporated
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to enable higher current density in integrated circuit re...
- Patent number 10,741,473
- Issue date Aug 11, 2020
- Texas Instruments Incorporated
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC with ion milled thin-film resistors
- Patent number 10,680,056
- Issue date Jun 9, 2020
- Texas Instruments Incorporated
- Bhaskar Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to enable higher current density in integrated circuit re...
- Patent number 10,475,725
- Issue date Nov 12, 2019
- Texas Instruments Incorporated
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ plasma treatment for thin film resistors
- Patent number 10,439,020
- Issue date Oct 8, 2019
- Texas Instruments Incorporated
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect processing for an integrated circuit metal stack
- Patent number 10,361,095
- Issue date Jul 23, 2019
- Texas Instruments Incorporated
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor with punch-through vias
- Patent number 10,354,951
- Issue date Jul 16, 2019
- Texas Instruments Incorporated
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for a thin film resistor using a via retardation...
- Patent number 10,211,278
- Issue date Feb 19, 2019
- Texas Instruments Incorporated
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect processing for a non-reactive metal stack
- Patent number 10,002,774
- Issue date Jun 19, 2018
- Texas Instruments Incorporated
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM RESISTOR WITH PUNCH-THROUGH VIAS
- Publication number 20210343642
- Publication date Nov 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC WITH ION MILLED THIN-FILM RESISTORS
- Publication number 20200212167
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- BHASKAR SRINIVASAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO ENABLE HIGHER CURRENT DENSITY IN INTEGRATED CIRCUIT RE...
- Publication number 20200051893
- Publication date Feb 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR AND TOP PLATE OF CAPACITOR SHARING A LAYER
- Publication number 20190305074
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR WITH PUNCH-THROUGH VIAS
- Publication number 20190295948
- Publication date Sep 26, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR WITH PUNCH-THROUGH VIAS
- Publication number 20190221516
- Publication date Jul 18, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU PLASMA TREATMENT FOR THIN FILM RESISTORS
- Publication number 20190198603
- Publication date Jun 27, 2019
- TEXAS INSTRUMENTS INCORPORATED
- ABBAS ALI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO ENABLE HIGHER CURRENT DENSITY IN INTEGRATED CIRCUIT RE...
- Publication number 20190139861
- Publication date May 9, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT PROCESSING FOR AN INTEGRATED CIRCUIT METAL STACK
- Publication number 20190074193
- Publication date Mar 7, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Abbas ALI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR A THIN FILM RESISTOR USING A VIA RETARDATION...
- Publication number 20190019858
- Publication date Jan 17, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS

Dhishan Kande

Person

Patents Grantslast 30 patents

Thin film resistor with punch-through vias

Thin film resistor with punch-through vias

Thin film resistor and top plate of capacitor sharing a layer

Structure to enable higher current density in integrated circuit re...

IC with ion milled thin-film resistors

Structure to enable higher current density in integrated circuit re...

In-situ plasma treatment for thin film resistors

Metal interconnect processing for an integrated circuit metal stack

Thin film resistor with punch-through vias

Device and method for a thin film resistor using a via retardation...

Metal interconnect processing for a non-reactive metal stack

Patents Applicationslast 30 patents

THIN FILM RESISTOR WITH PUNCH-THROUGH VIAS

IC WITH ION MILLED THIN-FILM RESISTORS

STRUCTURE TO ENABLE HIGHER CURRENT DENSITY IN INTEGRATED CIRCUIT RE...

THIN FILM RESISTOR AND TOP PLATE OF CAPACITOR SHARING A LAYER

THIN FILM RESISTOR WITH PUNCH-THROUGH VIAS

THIN FILM RESISTOR WITH PUNCH-THROUGH VIAS

IN-SITU PLASMA TREATMENT FOR THIN FILM RESISTORS

STRUCTURE TO ENABLE HIGHER CURRENT DENSITY IN INTEGRATED CIRCUIT RE...

METAL INTERCONNECT PROCESSING FOR AN INTEGRATED CIRCUIT METAL STACK

DEVICE AND METHOD FOR A THIN FILM RESISTOR USING A VIA RETARDATION...