Di Xu

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for semiconductor package inspection
- Patent number 10,794,840
- Issue date Oct 6, 2020
- Intel Corporation
- Liang Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
2D metrology technique for solder paste inspection
- Patent number 10,572,992
- Issue date Feb 25, 2020
- Intel Corporation
- Alireza Ashari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflectivity analysis to determine material on a surface
- Patent number 10,401,286
- Issue date Sep 3, 2019
- Intel Corporation
- Jianyong Mo
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
AN APPARATUS FOR SEMICONDUCTOR PACKAGE INSPECTION
- Publication number 20190339212
- Publication date Nov 7, 2019
- Intel Corporation
- Liang ZHANG
- G02 - OPTICS
Information Patent Application
REFLECTIVITY ANALYSIS TO DETERMINE MATERIAL ON A SURFACE
- Publication number 20190293558
- Publication date Sep 26, 2019
- Intel Corporation
- Jianyong MO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
2D METROLOGY TECHNIQUE FOR SOLDER PASTE INSPECTION
- Publication number 20190206038
- Publication date Jul 4, 2019
- Intel Corporation
- Alireza Ashari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR