Diana C. Duane

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Cedar Park, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Compliant electrically connective bumps for an adhesive flip chip i...
- Patent number 5,508,228
- Issue date Apr 16, 1996
- Microelectronics and Computer Technology Corporation
- Ernest R. Nolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/epoxy structures
- Patent number 5,183,972
- Issue date Feb 2, 1993
- Microelectronics and Computer Technology Corporation
- Diana C. Duane
- H01 - BASIC ELECTRIC ELEMENTS