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Diane Lai
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Corvallis, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming a through-substrate interconnect
Patent number
7,432,582
Issue date
Oct 7, 2008
Hewlett-Packard Development Company, L.P.
Diane Lai
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of forming a through-substrate interconnect
Patent number
6,902,872
Issue date
Jun 7, 2005
Hewlett-Packard Development Company, L.P.
Diane Lai
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Particle tolerant architecture for feed holes and method of manufac...
Patent number
6,764,605
Issue date
Jul 20, 2004
Hewlett-Packard Development Company, L.P.
Jeremy Donaldson
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Method of forming a through-substrate interconnect
Patent number
6,716,737
Issue date
Apr 6, 2004
Hewlett-Packard Development Company, L.P.
Hubert Vander Plas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate with fluidic channel and method of manufacturing
Patent number
6,555,480
Issue date
Apr 29, 2003
Hewlett-Packard Development Company, L.P.
Donald J Milligan
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Patents Applications
last 30 patents
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Patent Application
METHOD OF FORMING A THROUGH-SUBSTRATE INTERCONNECT
Publication number
20040018712
Publication date
Jan 29, 2004
Hubert Vander Plas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a through-substrate interconnect
Publication number
20040017419
Publication date
Jan 29, 2004
Diane Lai
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Particle tolerant architecture for feed holes and method of manufac...
Publication number
20030142185
Publication date
Jul 31, 2003
Jeremy Donaldson
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
Substrate with fluidic channel and method of manufacturing
Publication number
20030027426
Publication date
Feb 6, 2003
Donald J. Milligan
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS