Diane M. Christie

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Eau Claire, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating metallized chip carries from wafer-shaped sub...
- Patent number 5,358,826
- Issue date Oct 25, 1994
- Cray Research, Inc.
- Richard R. Steitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-metallized chip carrier
- Patent number H1153
- Issue date Mar 2, 1993
- Melvin C. August
- 357 -
Information Patent Grant
Method of fabricating metallized chip carriers from wafer-shaped su...
- Patent number 5,182,420
- Issue date Jan 26, 1993
- Cray Research, Inc.
- Richard R. Steitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible automated bonding method and apparatus
- Patent number 5,127,570
- Issue date Jul 7, 1992
- Cray Research, Inc.
- Richard R. Steitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR