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Diane Sahakian
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Tempe, AZ, US
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Patents Grants
last 30 patents
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Patent Grant
Leadframe-based mold array package heat spreader and fabrication me...
Patent number
8,581,375
Issue date
Nov 12, 2013
Stats Chippac Ltd.
Kambhampati Ramakrishna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe-based mold array package heat spreader and fabrication me...
Patent number
8,211,753
Issue date
Jul 3, 2012
Stats Chippac Ltd.
Kambhampati Ramakrishna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array-molded package heat spreader and fabrication method therefor
Patent number
7,863,730
Issue date
Jan 4, 2011
ST Assembly Test Services Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-molded leadframe and method therefor
Patent number
7,399,658
Issue date
Jul 15, 2008
Stats Chippac Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging for optoelectronic devices
Patent number
7,091,469
Issue date
Aug 15, 2006
ST Assembly Test Services Ltd.
Dean Paul Kossives
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
LEADFRAME-BASED MOLD ARRAY PACKAGE HEAT SPREADER AND FABRICATION ME...
Publication number
20120241929
Publication date
Sep 27, 2012
Kambhampati Ramakrishna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging for optoelectronic devices
Publication number
20050258216
Publication date
Nov 24, 2005
Dean Paul Kossives
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe-based mold array package heat spreader and fabrication me...
Publication number
20050046012
Publication date
Mar 3, 2005
STATS ChipPAC Ltd.
Kambhampati Ramakrishna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Array-molded package heat spreader and fabrication method therefor
Publication number
20050046015
Publication date
Mar 3, 2005
ST ASSEMBLY TEST SERVICES LTD.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS