Diann-Fang LIN

Person

Miao-Li, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging structure and manufacturing method for the same
- Patent number 10,651,146
- Issue date May 12, 2020
- Dawning Leading Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and manufacturing method for the...
- Patent number 9,892,988
- Issue date Feb 13, 2018
- Dawning Leading Technology Inc.
- Yu-Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal top stacking package structure and method for manufacturing t...
- Patent number 9,887,145
- Issue date Feb 6, 2018
- DAWNING LEADING TECHNOLOGY INC.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure for thin die and method for manufacturing the same
- Patent number 9,646,937
- Issue date May 9, 2017
- Dawning Leading Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure for quad flat no-lead package, quad flat no-le...
- Patent number 9,607,933
- Issue date Mar 28, 2017
- DAWNING LEADING TECHNOLOGY INC
- Diann Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip stacking package structure and method for manufacturing t...
- Patent number 9,412,722
- Issue date Aug 9, 2016
- DAWNING LEADING TECHNOLOGY INC.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro electronic component structure
- Patent number 9,161,446
- Issue date Oct 13, 2015
- DAWNING LEADING TECHNOLOGY INC
- Diann Fang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a chip packaging structure
- Patent number 8,962,390
- Issue date Feb 24, 2015
- Dawning Leading Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metal Top Stacking Package Structure and Method for Manufacturing t...
- Publication number 20160293509
- Publication date Oct 6, 2016
- Dawning Leading Technology Inc.
- Diann-Fang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP STACKING PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING T...
- Publication number 20160240512
- Publication date Aug 18, 2016
- Dawning Leading Technology Inc.
- Diann-Fang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR THIN DIE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150357288
- Publication date Dec 10, 2015
- DAWNING LEADING TECHNOLOGY INC.
- Diann-Fang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME STRUCTURE FOR QUAD FLAT NO-LEAD PACKAGE, QUAD FLAT NO-LE...
- Publication number 20150228561
- Publication date Aug 13, 2015
- DAWNING LEADING TECHNOLOGY INC.
- DIANN FANG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE...
- Publication number 20150228596
- Publication date Aug 13, 2015
- DAWNING LEADING TECHNOLOGY INC.
- Yu-Shan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO ELECTRONIC COMPONENT STRUCTURE
- Publication number 20140202754
- Publication date Jul 24, 2014
- DAWNING LEADING TECHNOLOGY INC.
- DIANN FANG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE WITH CONNECTION INTERFACE, CIRCUIT BOARD THEREOF,...
- Publication number 20130120947
- Publication date May 16, 2013
- DAWNING LEADING TECHNOLOGY INC.
- Diann-Fang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20130062783
- Publication date Mar 14, 2013
- DAWNING LEADING TECHNOLOGY INC.
- Diann-Fang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CHIP PACKAGING STRUCTURE
- Publication number 20130065363
- Publication date Mar 14, 2013
- DAWNING LEADING TECHNOLOGY INC.
- Diann-Fang LIN
- H01 - BASIC ELECTRIC ELEMENTS

Diann-Fang LIN

Person

Patents Grantslast 30 patents

Chip packaging structure and manufacturing method for the same

Semiconductor packaging structure and manufacturing method for the...

Metal top stacking package structure and method for manufacturing t...

Packaging structure for thin die and method for manufacturing the same

Lead frame structure for quad flat no-lead package, quad flat no-le...

Multichip stacking package structure and method for manufacturing t...

Micro electronic component structure

Method for manufacturing a chip packaging structure

Patents Applicationslast 30 patents

Metal Top Stacking Package Structure and Method for Manufacturing t...

MULTICHIP STACKING PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING T...

PACKAGING STRUCTURE FOR THIN DIE AND METHOD FOR MANUFACTURING THE SAME

LEAD FRAME STRUCTURE FOR QUAD FLAT NO-LEAD PACKAGE, QUAD FLAT NO-LE...

SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE...

MICRO ELECTRONIC COMPONENT STRUCTURE

ELECTRICAL DEVICE WITH CONNECTION INTERFACE, CIRCUIT BOARD THEREOF,...

CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

METHOD FOR MANUFACTURING A CHIP PACKAGING STRUCTURE