Didem Ernur

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Kessel-Lo, BE

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit manufacturing method and integrated circuit
- Patent number 8,722,527
- Issue date May 13, 2014
- NXP B.V.
- Didem Ernur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microscopic structure packaging method and device with packaged mic...
- Patent number 8,330,238
- Issue date Dec 11, 2012
- NXP B.V.
- Johannes van Wingerden
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT MANUFACTURING METHOD AND INTEGRATED CIRCUIT
- Publication number 20120126408
- Publication date May 24, 2012
- NXP B.V.
- Didem Ernur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MIC...
- Publication number 20110175178
- Publication date Jul 21, 2011
- NXP B.V.
- Johannes van WINGERDEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY