Didier Campos

Person

Charavines, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device comprising an electronic chip mounted on top of a...
- Patent number 11,488,884
- Issue date Nov 1, 2022
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an integrated electromagnetic antenna
- Patent number 11,355,851
- Issue date Jun 7, 2022
- STMicroelectronics S.A.
- Frederic Gianesello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected stacked circuits
- Patent number 11,302,672
- Issue date Apr 12, 2022
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices and fabricating processes
- Patent number 11,107,742
- Issue date Aug 31, 2021
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for collective (wafer-scale) fabrication of electronic devic...
- Patent number 9,870,947
- Issue date Jan 16, 2018
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT SINK FASTENED ON THE SUBSTRATE OF A PACKAGE OF INTEGRATED CIRC...
- Publication number 20240339375
- Publication date Oct 10, 2024
- STMicroelectronics International N.V.
- Didier CAMPOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ELECTRONIC CHIP MOUNTED ON TOP OF A...
- Publication number 20220384298
- Publication date Dec 1, 2022
- STMicroelectronics (Grenoble 2) SAS
- Didier CAMPOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTED STACKED CIRCUITS
- Publication number 20220238492
- Publication date Jul 28, 2022
- STMicroelectronics (Grenoble 2) SAS
- Didier CAMPOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ELECTRONIC CHIP MOUNTED ON TOP OF A...
- Publication number 20200381328
- Publication date Dec 3, 2020
- STMicroelectronics (Grenoble 2) SAS
- Didier CAMPOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN INTEGRATED ELECTROMAGNETIC ANTENNA
- Publication number 20200381833
- Publication date Dec 3, 2020
- STMicroelectronics S.A.
- Frederic GIANESELLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTED STACKED CIRCUITS
- Publication number 20200303348
- Publication date Sep 24, 2020
- STMicroelectronics (Grenoble 2) SAS
- Didier CAMPOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING AN ELECTRONIC CHIP AND AN ANTENNA
- Publication number 20200152586
- Publication date May 14, 2020
- STMicroelectronics (Grenoble 2) SAS
- Didier CAMPOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND FABRICATING PROCESSES
- Publication number 20190287874
- Publication date Sep 19, 2019
- STMicroelectronics (Grenoble 2) SAS
- Didier CAMPOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COLLECTIVE (WAFER-SCALE) FABRICATION OF ELECTRONIC DEVIC...
- Publication number 20180005889
- Publication date Jan 4, 2018
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS

Didier Campos

Person

Patents Grantslast 30 patents

Electronic device comprising an electronic chip mounted on top of a...

Electronic device comprising an integrated electromagnetic antenna

Interconnected stacked circuits

Electronic devices and fabricating processes

Method for collective (wafer-scale) fabrication of electronic devic...

Patents Applicationslast 30 patents

HEAT SINK FASTENED ON THE SUBSTRATE OF A PACKAGE OF INTEGRATED CIRC...

ELECTRONIC DEVICE COMPRISING AN ELECTRONIC CHIP MOUNTED ON TOP OF A...

INTERCONNECTED STACKED CIRCUITS

ELECTRONIC DEVICE COMPRISING AN ELECTRONIC CHIP MOUNTED ON TOP OF A...

ELECTRONIC DEVICE COMPRISING AN INTEGRATED ELECTROMAGNETIC ANTENNA

INTERCONNECTED STACKED CIRCUITS

ELECTRONIC DEVICE INCLUDING AN ELECTRONIC CHIP AND AN ANTENNA

ELECTRONIC DEVICES AND FABRICATING PROCESSES

METHOD FOR COLLECTIVE (WAFER-SCALE) FABRICATION OF ELECTRONIC DEVIC...