Didier Landru

Person

Champ des Froges, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a composite structure comprising a thin layer...
- Patent number 12,198,983
- Issue date Jan 14, 2025
- Soitec
- Ionut Radu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 12,165,900
- Issue date Dec 10, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer from a donor substrate onto...
- Patent number 12,142,517
- Issue date Nov 12, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring blocks from a donor substrate onto a receiv...
- Patent number 12,094,759
- Issue date Sep 17, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for fracturing a plurality of wafer assemblies
- Patent number 12,002,690
- Issue date Jun 4, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid structure and a method for manufacturing the same
- Patent number 11,930,710
- Issue date Mar 12, 2024
- Soitec
- Didier Landru
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for transferring a useful layer onto a support substrate
- Patent number 11,881,429
- Issue date Jan 23, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer to a carrier substrate
- Patent number 11,876,015
- Issue date Jan 16, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring blocks from a donor substrate onto a receiv...
- Patent number 11,776,843
- Issue date Oct 3, 2023
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for transferring a thin layer to a support substrate that h...
- Patent number 11,742,817
- Issue date Aug 29, 2023
- Soitec
- Isabelle Huyet
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 11,742,233
- Issue date Aug 29, 2023
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates including useful layers
- Patent number 11,670,540
- Issue date Jun 6, 2023
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable structure and removal method using the structure
- Patent number 11,424,156
- Issue date Aug 23, 2022
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a hybrid structure
- Patent number 11,349,065
- Issue date May 31, 2022
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for smoothing the surface of a semiconductor-on-insulator s...
- Patent number 11,276,605
- Issue date Mar 15, 2022
- Soitec
- Oleg Kononchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a donor substrate for creating a three-dimensi...
- Patent number 11,239,108
- Issue date Feb 1, 2022
- Soitec
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical furnace with device for trapping contaminants
- Patent number 11,219,851
- Issue date Jan 11, 2022
- Soitec
- Didier Landru
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method for transferring a useful layer
- Patent number 10,950,491
- Issue date Mar 16, 2021
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 10,910,250
- Issue date Feb 2, 2021
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal treatment system with collector device
- Patent number 10,510,565
- Issue date Dec 17, 2019
- Soitec
- Didier Landru
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Structure for radiofrequency applications
- Patent number 10,250,282
- Issue date Apr 2, 2019
- Soitec
- Oleg Kononchuk
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for separating a layer from a composite structure
- Patent number 10,220,603
- Issue date Mar 5, 2019
- Soitec
- Didier Landru
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for smoothing the surface of a structure
- Patent number 10,134,602
- Issue date Nov 20, 2018
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating at least two substrates along a selected inte...
- Patent number 10,093,086
- Issue date Oct 9, 2018
- Soitec
- Didier Landru
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for transferring a useful layer
- Patent number 9,922,867
- Issue date Mar 20, 2018
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for separating two substrates
- Patent number 9,914,233
- Issue date Mar 13, 2018
- Soitec
- Didier Landru
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method for dissolving a silicon dioxide layer
- Patent number 9,911,624
- Issue date Mar 6, 2018
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a plurality of structures
- Patent number 9,875,914
- Issue date Jan 23, 2018
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a composite structure
- Patent number 9,799,549
- Issue date Oct 24, 2017
- Soitec
- Sebastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly process of two substrates
- Patent number 9,718,261
- Issue date Aug 1, 2017
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR TRANSFERRING BLOCKS FROM A DONOR SUBSTRATE ONTO A RECEIV...
- Publication number 20250022748
- Publication date Jan 16, 2025
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR FRACTURING A PLURALITY OF WAFER ASSEMBLIES
- Publication number 20240222158
- Publication date Jul 4, 2024
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A MULTILAYER STRUCTURE
- Publication number 20240190120
- Publication date Jun 13, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Marilyne ROUMANIE
- B32 - LAYERED PRODUCTS
Information Patent Application
HYBRID STRUCTURE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240147864
- Publication date May 2, 2024
- SOITEC
- Didier Landru
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...
- Publication number 20240112908
- Publication date Apr 4, 2024
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A THIN LAYER
- Publication number 20240030060
- Publication date Jan 25, 2024
- SOITEC
- Frédéric Mazen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DONOR SUBSTRATE FOR THE TRANSFER OF A THIN LAYER AND ASSOCIATED TRA...
- Publication number 20240030061
- Publication date Jan 25, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Larry Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...
- Publication number 20240030033
- Publication date Jan 25, 2024
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20240021461
- Publication date Jan 18, 2024
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20230411205
- Publication date Dec 21, 2023
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...
- Publication number 20230260841
- Publication date Aug 17, 2023
- SOITEC
- Ionut Radu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DETACHABLE TEMPORARY SUBSTRATE COMPATIBLE WITH VERY HIGH TEMPERATUR...
- Publication number 20230230868
- Publication date Jul 20, 2023
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...
- Publication number 20230160102
- Publication date May 25, 2023
- SOITEC
- Hugo Biard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS FOR HYDROPHILICALLY BONDING SUBSTRATES
- Publication number 20220319910
- Publication date Oct 6, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Vincent Larrey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A HYBRID STRUCTURE
- Publication number 20220278269
- Publication date Sep 1, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR FRACTURING A PLURALITY OF WAFER ASSEMBLIES
- Publication number 20220181173
- Publication date Jun 9, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A USEFUL LAYER ONTO A SUPPORT SUBSTRATE
- Publication number 20220172983
- Publication date Jun 2, 2022
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A USE FUL LAYER TO A CARRIER SUBSTRATE
- Publication number 20220157650
- Publication date May 19, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A USEFUL LAYER ONTO A SUPPORT SUBSTRATE
- Publication number 20220157651
- Publication date May 19, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING BLOCKS FROM A DONOR SUBSTRATE ONTO A RECEIV...
- Publication number 20220148911
- Publication date May 12, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING DEVICE FOR AN ASSEMBLY THAT IS TO BE FRACTURED
- Publication number 20220059370
- Publication date Feb 24, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES INCLUDING USEFUL LAYERS
- Publication number 20210202302
- Publication date Jul 1, 2021
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20210118717
- Publication date Apr 22, 2021
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A DONOR SUBSTRATE FOR CREATING A THREE-DIMENSI...
- Publication number 20210057268
- Publication date Feb 25, 2021
- SOITEC
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE STRUCTURE AND REMOVAL METHOD USING THE STRUCTURE
- Publication number 20210050249
- Publication date Feb 18, 2021
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING THE SPLITTING OF A SUBSTRATE WEAKENED BY IMPLA...
- Publication number 20210028036
- Publication date Jan 28, 2021
- SOITEC
- François Rieutord
- G01 - MEASURING TESTING
Information Patent Application
PROCESS FOR TRANSFERRING A THIN LAYER TO A SUPPORT SUBSTRATE THAT H...
- Publication number 20200186117
- Publication date Jun 11, 2020
- SOITEC
- Isabelle Huyet
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
VERTICAL FURNACE WITH DEVICE FOR TRAPPING CONTAMINANTS
- Publication number 20200054978
- Publication date Feb 20, 2020
- SOITEC
- Didier Landru
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PROCESS FOR SMOOTHING THE SURFACE OF A SEMICONDUCTOR-ON-INSULATOR S...
- Publication number 20190348319
- Publication date Nov 14, 2019
- SOITEC
- Oleg Kononchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A USEFUL LAYER
- Publication number 20190221471
- Publication date Jul 18, 2019
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS

Didier Landru

Person

Patents Grantslast 30 patents

Method for producing a composite structure comprising a thin layer...

Method of mechanical separation for a double layer transfer

Method for transferring a useful layer from a donor substrate onto...

Method for transferring blocks from a donor substrate onto a receiv...

System for fracturing a plurality of wafer assemblies

Hybrid structure and a method for manufacturing the same

Method for transferring a useful layer onto a support substrate

Method for transferring a useful layer to a carrier substrate

Method for transferring blocks from a donor substrate onto a receiv...

Process for transferring a thin layer to a support substrate that h...

Method of mechanical separation for a double layer transfer

Substrates including useful layers

Removable structure and removal method using the structure

Method for manufacturing a hybrid structure

Process for smoothing the surface of a semiconductor-on-insulator s...

Method for producing a donor substrate for creating a three-dimensi...

Vertical furnace with device for trapping contaminants

Method for transferring a useful layer

Method of mechanical separation for a double layer transfer

Thermal treatment system with collector device

Structure for radiofrequency applications

Method for separating a layer from a composite structure

Process for smoothing the surface of a structure

Method for separating at least two substrates along a selected inte...

Method for transferring a useful layer

Device for separating two substrates

Method for dissolving a silicon dioxide layer

Process for manufacturing a plurality of structures

Process for manufacturing a composite structure

Assembly process of two substrates

Patents Applicationslast 30 patents

METHOD FOR TRANSFERRING BLOCKS FROM A DONOR SUBSTRATE ONTO A RECEIV...

SYSTEM FOR FRACTURING A PLURALITY OF WAFER ASSEMBLIES

METHOD OF MANUFACTURING A MULTILAYER STRUCTURE

HYBRID STRUCTURE AND A METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...

METHOD FOR PREPARING A THIN LAYER

DONOR SUBSTRATE FOR THE TRANSFER OF A THIN LAYER AND ASSOCIATED TRA...

METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...

DETACHABLE TEMPORARY SUBSTRATE COMPATIBLE WITH VERY HIGH TEMPERATUR...

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...

PROCESS FOR HYDROPHILICALLY BONDING SUBSTRATES

METHOD FOR MANUFACTURING A HYBRID STRUCTURE

SYSTEM FOR FRACTURING A PLURALITY OF WAFER ASSEMBLIES

METHOD FOR TRANSFERRING A USEFUL LAYER ONTO A SUPPORT SUBSTRATE

METHOD FOR TRANSFERRING A USE FUL LAYER TO A CARRIER SUBSTRATE

METHOD FOR TRANSFERRING A USEFUL LAYER ONTO A SUPPORT SUBSTRATE

METHOD FOR TRANSFERRING BLOCKS FROM A DONOR SUBSTRATE ONTO A RECEIV...

HOLDING DEVICE FOR AN ASSEMBLY THAT IS TO BE FRACTURED

SUBSTRATES INCLUDING USEFUL LAYERS

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

METHOD FOR PRODUCING A DONOR SUBSTRATE FOR CREATING A THREE-DIMENSI...

REMOVABLE STRUCTURE AND REMOVAL METHOD USING THE STRUCTURE

METHOD FOR DETECTING THE SPLITTING OF A SUBSTRATE WEAKENED BY IMPLA...

PROCESS FOR TRANSFERRING A THIN LAYER TO A SUPPORT SUBSTRATE THAT H...

VERTICAL FURNACE WITH DEVICE FOR TRAPPING CONTAMINANTS

PROCESS FOR SMOOTHING THE SURFACE OF A SEMICONDUCTOR-ON-INSULATOR S...

METHOD FOR TRANSFERRING A USEFUL LAYER