Didier Lefebvre

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Mundelein, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of separating and handling a thin semiconductor die on a wafer
- Patent number 6,772,509
- Issue date Aug 10, 2004
- Motorola, Inc.
- Shiuh-Hui Steven Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for determining bulk material properties of el...
- Patent number 6,578,431
- Issue date Jun 17, 2003
- Virginia Tech Intellectual Properties, Inc.
- David A. Dillard
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method of separating and handling a thin semiconductor die on a wafer
- Publication number 20030140486
- Publication date Jul 31, 2003
- Shiuh-Hui Steven Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for determining bulk material properties of el...
- Publication number 20010049967
- Publication date Dec 13, 2001
- David A. Dillard
- G01 - MEASURING TESTING