Dieter Dornisch

Person

Carlsbad, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Deep trench isolation structure and method for improved product yield
- Patent number 9,997,396
- Issue date Jun 12, 2018
- Newport Fab, LLC
- George E. Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolation and method for forming same
- Patent number 7,772,673
- Issue date Aug 10, 2010
- Newport Fab, LLC
- Kevin Q. Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Densely packed metal segments patterned in a semiconductor die
- Patent number 7,709,949
- Issue date May 4, 2010
- Newport Fab, LLC
- Tinghao F. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a MIM capacitor having increased capacitance...
- Patent number 7,268,038
- Issue date Sep 11, 2007
- Newport Fab, LLC
- Dieter Dornisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning densely packed metal segments in a semiconduc...
- Patent number 6,919,272
- Issue date Jul 19, 2005
- Newport Fab, LLC
- Tinghao F. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-k dielectric stack in a MIM capacitor and method for its fabri...
- Patent number 6,885,056
- Issue date Apr 26, 2005
- Newport Fab, LLC
- Dieter Dornisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit plating using highly-complexed copper plating baths
- Patent number 6,709,564
- Issue date Mar 23, 2004
- Rockwell Scientific Licensing, LLC
- D. Morgan Tench
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for barrier layer formation
- Patent number 6,255,192
- Issue date Jul 3, 2001
- Conexant Systems, Inc.
- Dieter Dornisch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Deep Trench Isolation Structure and Method for Improved Product Yield
- Publication number 20150340267
- Publication date Nov 26, 2015
- Newport Fab, LLC dba Jazz Semiconductor.
- George E. Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Densely packed metal segments patterned in a semiconductor die
- Publication number 20090243114
- Publication date Oct 1, 2009
- Newport Fab, LLC dba Jazz Semiconductor.
- Tinghao F. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a MIM capacitor having increased capacitance...
- Publication number 20060110889
- Publication date May 25, 2006
- Newport Fab, LLC dba Jazz Semiconductor.
- Dieter Dornisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-K DIELECTRIC STACK IN A MIM CAPACITOR AND METHOD FOR ITS FABRI...
- Publication number 20050087790
- Publication date Apr 28, 2005
- Newport Fab, LLC dba Jazz Semiconductor.
- Dieter Dornisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for patterning densely packed metal segments in a semiconduc...
- Publication number 20040152302
- Publication date Aug 5, 2004
- Newport Fab, LLC dba Jazz Semiconductor.
- Tinghao F. Wang
- H01 - BASIC ELECTRIC ELEMENTS

Dieter Dornisch

Person

Patents Grantslast 30 patents

Deep trench isolation structure and method for improved product yield

Deep trench isolation and method for forming same

Densely packed metal segments patterned in a semiconductor die

Method for fabricating a MIM capacitor having increased capacitance...

Method for patterning densely packed metal segments in a semiconduc...

High-k dielectric stack in a MIM capacitor and method for its fabri...

Integrated circuit plating using highly-complexed copper plating baths

Methods for barrier layer formation

Patents Applicationslast 30 patents

Deep Trench Isolation Structure and Method for Improved Product Yield

Densely packed metal segments patterned in a semiconductor die

Method for fabricating a MIM capacitor having increased capacitance...

HIGH-K DIELECTRIC STACK IN A MIM CAPACITOR AND METHOD FOR ITS FABRI...

Method for patterning densely packed metal segments in a semiconduc...