Digvijay A. Raorane

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
IC package including multi-chip unit with bonded integrated heat sp...
- Patent number 12,183,649
- Issue date Dec 31, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge co-planar placement architectures and processes
- Patent number 12,176,268
- Issue date Dec 24, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge die with through-silicon vias
- Patent number 12,159,813
- Issue date Dec 3, 2024
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested architectures for enhanced heterogeneous integration
- Patent number 12,142,545
- Issue date Nov 12, 2024
- Intel Corporation
- Ravindranath Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 12,009,318
- Issue date Jun 11, 2024
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with embedded communication cavity
- Patent number 11,978,948
- Issue date May 7, 2024
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested architectures for enhanced heterogeneous integration
- Patent number 11,798,865
- Issue date Oct 24, 2023
- Intel Corporation
- Ravindranath Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package including multi-chip unit with bonded integrated heat sp...
- Patent number 11,749,577
- Issue date Sep 5, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Landing pad apparatus for through-silicon-vias
- Patent number 11,742,270
- Issue date Aug 29, 2023
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested architectures for enhanced heterogeneous integration
- Patent number 11,742,261
- Issue date Aug 29, 2023
- Intel Corporation
- Ravindranath Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic interposers for on-die interconnects
- Patent number 11,594,493
- Issue date Feb 28, 2023
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge with through-silicon vias
- Patent number 11,587,851
- Issue date Feb 21, 2023
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package including multi-chip unit with bonded integrated heat sp...
- Patent number 11,581,235
- Issue date Feb 14, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge hub tiling architecture
- Patent number 11,569,173
- Issue date Jan 31, 2023
- Intel Corporation
- Andrew P. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and system with package stiffening magnetic inductor core...
- Patent number 11,527,489
- Issue date Dec 13, 2022
- Intel Corporation
- Michael J. Hill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enclosure for an electronic component
- Patent number 11,488,880
- Issue date Nov 1, 2022
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having passive support wafer
- Patent number 11,417,630
- Issue date Aug 16, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 11,322,457
- Issue date May 3, 2022
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with embedded communication cavity
- Patent number 11,239,186
- Issue date Feb 1, 2022
- Intel Corporation
- Digvijay Raorane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High frequency waveguide structure
- Patent number 11,195,806
- Issue date Dec 7, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding u...
- Patent number 11,189,573
- Issue date Nov 30, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to achieve variable dielectric thickness in packages for bet...
- Patent number 11,145,583
- Issue date Oct 12, 2021
- Intel Corporation
- Digvijay Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with embedded communication cavity
- Patent number 11,128,029
- Issue date Sep 21, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge with through-silicon Vias
- Patent number 11,049,798
- Issue date Jun 29, 2021
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package including multi-chip unit with bonded integrated heat sp...
- Patent number 11,011,448
- Issue date May 18, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable interposer to interposer connection
- Patent number 10,804,117
- Issue date Oct 13, 2020
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic interposers for on-die interconnects
- Patent number 10,707,169
- Issue date Jul 7, 2020
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper resistant lock assembly having physical unclonable functions
- Patent number 10,421,432
- Issue date Sep 24, 2019
- Intel Corporation
- Victoria C. Moore
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20250046680
- Publication date Feb 6, 2025
- Intel Corporation
- Aditya S. VAIDYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20240128162
- Publication date Apr 18, 2024
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20230411245
- Publication date Dec 21, 2023
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...
- Publication number 20230360994
- Publication date Nov 9, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20230197574
- Publication date Jun 22, 2023
- Intel Corporation
- Aditya S. VAIDYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY WITH STIFFENER
- Publication number 20230197636
- Publication date Jun 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20230133429
- Publication date May 4, 2023
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE HUB TILING ARCHITECTURE
- Publication number 20230138386
- Publication date May 4, 2023
- Intel Corporation
- ANDREW P. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...
- Publication number 20230132197
- Publication date Apr 27, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER
- Publication number 20230108000
- Publication date Apr 6, 2023
- Intel Corporation
- Vishal JAVVAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER
- Publication number 20220352121
- Publication date Nov 3, 2022
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20220230972
- Publication date Jul 21, 2022
- Intel Corporation
- Digvijay A. RAORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE
- Publication number 20220102242
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIR...
- Publication number 20220102231
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH EMBEDDED COMMUNICATION CAVITY
- Publication number 20210391638
- Publication date Dec 16, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20210375719
- Publication date Dec 2, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE POWER DELIVERY ARCHITECTURES AND PROCESSES
- Publication number 20210305133
- Publication date Sep 30, 2021
- Intel Coporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES
- Publication number 20210305132
- Publication date Sep 30, 2021
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING PAD APPARATUS FOR THROUGH-SILICON-VIAS
- Publication number 20210287975
- Publication date Sep 16, 2021
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20210272881
- Publication date Sep 2, 2021
- Intel Corporation
- Aditya S. VAIDYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...
- Publication number 20210242104
- Publication date Aug 5, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER MATERIALS BETWEEN BUMPS AND PADS
- Publication number 20210057348
- Publication date Feb 25, 2021
- Intel Corporation
- Ehren HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...
- Publication number 20210035881
- Publication date Feb 4, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC INTERPOSERS FOR ON-DIE INTERCONNECTS
- Publication number 20210028117
- Publication date Jan 28, 2021
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20200286814
- Publication date Sep 10, 2020
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20200251426
- Publication date Aug 6, 2020
- Intel Corporation
- Digvijay A. RAORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC INTERPOSERS FOR ON-DIE INTERCONNECTS
- Publication number 20200211966
- Publication date Jul 2, 2020
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCLOSURE FOR AN ELECTRONIC COMPONENT
- Publication number 20200098655
- Publication date Mar 26, 2020
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY WITH STIFFENER
- Publication number 20200083180
- Publication date Mar 12, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING FOR SEMICONDUCTOR PACKAGES U...
- Publication number 20200075501
- Publication date Mar 5, 2020
- Intel Corporation
- Digvijay A. RAORANE
- H01 - BASIC ELECTRIC ELEMENTS

Digvijay A. Raorane

Person

Patents Grantslast 30 patents

IC package including multi-chip unit with bonded integrated heat sp...

Open cavity bridge co-planar placement architectures and processes

Embedded bridge die with through-silicon vias

Nested architectures for enhanced heterogeneous integration

Dummy die structures of a packaged integrated circuit device

Open cavity bridge power delivery architectures and processes

Control of warpage using ABF GC cavity for embedded die package

Die with embedded communication cavity

Nested architectures for enhanced heterogeneous integration

IC package including multi-chip unit with bonded integrated heat sp...

Landing pad apparatus for through-silicon-vias

Nested architectures for enhanced heterogeneous integration

Ceramic interposers for on-die interconnects

Embedded bridge with through-silicon vias

IC package including multi-chip unit with bonded integrated heat sp...

Bridge hub tiling architecture

Apparatus and system with package stiffening magnetic inductor core...

Enclosure for an electronic component

Semiconductor package having passive support wafer

Control of warpage using ABF GC cavity for embedded die package

Die with embedded communication cavity

High frequency waveguide structure

Semiconductor package with electromagnetic interference shielding u...

Method to achieve variable dielectric thickness in packages for bet...

Die with embedded communication cavity

Embedded bridge with through-silicon Vias

IC package including multi-chip unit with bonded integrated heat sp...

Method to enable interposer to interposer connection

Ceramic interposers for on-die interconnects

Tamper resistant lock assembly having physical unclonable functions

Patents Applicationslast 30 patents

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

ELECTRONIC PACKAGE ASSEMBLY WITH STIFFENER

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

BRIDGE HUB TILING ARCHITECTURE

IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...

TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER

SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER

CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE

DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE

DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIR...

DIE WITH EMBEDDED COMMUNICATION CAVITY

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

OPEN CAVITY BRIDGE POWER DELIVERY ARCHITECTURES AND PROCESSES

OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES

LANDING PAD APPARATUS FOR THROUGH-SILICON-VIAS

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...

BARRIER MATERIALS BETWEEN BUMPS AND PADS

IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...

CERAMIC INTERPOSERS FOR ON-DIE INTERCONNECTS

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE

CERAMIC INTERPOSERS FOR ON-DIE INTERCONNECTS

ENCLOSURE FOR AN ELECTRONIC COMPONENT

ELECTRONIC PACKAGE ASSEMBLY WITH STIFFENER

ELECTROMAGNETIC INTERFERENCE SHIELDING FOR SEMICONDUCTOR PACKAGES U...