Dimitri R. Kioussis

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a conductive interconnect arrangement for a s...
- Patent number 8,183,149
- Issue date May 22, 2012
- GLOBALFOUNDRIES Inc.
- David M. Permana
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING A BI-LAYER CAP LAYER ON COPPER-BASED CONDUCTIVE...
- Publication number 20140167265
- Publication date Jun 19, 2014
- GLOBALFOUNDRIES INC.
- Dimitri R. Kioussis
- H01 - BASIC ELECTRIC ELEMENTS