Dinah LIEU

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming flip chip systems
- Patent number 10,236,267
- Issue date Mar 19, 2019
- Kyocera International, Inc.
- Dinah Lieu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP ATTACHMENT SYSTEM
- Publication number 20160035686
- Publication date Feb 4, 2016
- Kyocera America Inc
- Dinah LIEU
- H01 - BASIC ELECTRIC ELEMENTS