Dinesh Gupta

Person

Hopewell, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional microelectronic package with embedded cooling cha...
- Patent number 11,462,512
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 11,177,217
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor microcooler
- Patent number 11,056,418
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Donald F. Canaperi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor wafer having trenches with varied dimensions for mult...
- Patent number 11,049,844
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor microcooler
- Patent number 11,049,789
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Donald F. Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar wafer level fan-out of multi-chip modules having different s...
- Patent number 10,943,883
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional microelectronic package with embedded cooling cha...
- Patent number 10,937,764
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 10,580,738
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor microcooler
- Patent number 10,553,522
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Donald F. Canaperi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor microcooler
- Patent number 10,553,516
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Donald F. Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper microcooler structure and fabrication
- Patent number 10,490,480
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper microcooler structure and fabrication
- Patent number 10,490,481
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical assemblies for transmitting and manipulating optical beams
- Patent number 8,089,133
- Issue date Jan 3, 2012
- International Business Machines Corporation
- Dinesh Gupta
- G02 - OPTICS
Information Patent Grant
Optical assemblies for transmitting and manipulating optical beams
- Patent number 6,836,015
- Issue date Dec 28, 2004
- International Business Machines Corporation
- Monty M. Denneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for repairing electronic packages
- Patent number 6,713,686
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screening mask having a stress-relieving area
- Patent number 6,662,718
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Evelyn Barrington
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Screening method for double pass screening
- Patent number 6,631,675
- Issue date Oct 14, 2003
- International Business Machines Corporation
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for screening features on an electronic substrate with a lo...
- Patent number 6,475,555
- Issue date Nov 5, 2002
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-patterned substrate layers for being personalized as needed
- Patent number 6,341,417
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Dinesh Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a multilayer ceramic product with thin layers
- Patent number 6,245,185
- Issue date Jun 12, 2001
- International Business Machines Corporation
- Raschid J. Bezama
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of forming a multilayer ceramic substrate with max-punched vias
- Patent number 6,231,707
- Issue date May 15, 2001
- International Business Machines Corporation
- Dinesh Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic substrates having internal capacitor, and proces...
- Patent number 5,655,209
- Issue date Aug 5, 1997
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making ceramic substrates from thin and thick ceramic gr...
- Patent number 5,601,672
- Issue date Feb 11, 1997
- International Business Machines Corporation
- Jon A. Casey
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process for producing circuitized layers and multilayer ceramic sub...
- Patent number 5,480,503
- Issue date Jan 2, 1996
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MICROELECTRONIC PACKAGE WITH EMBEDDED COOLING CHA...
- Publication number 20210118854
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT S...
- Publication number 20210091032
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER HAVING TRENCHES WITH VARIED DIMENSIONS FOR MULT...
- Publication number 20210005573
- Publication date Jan 7, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MICROELECTRONIC PACKAGE WITH EMBEDDED COOLING CHA...
- Publication number 20200294968
- Publication date Sep 17, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Microcooler
- Publication number 20200161216
- Publication date May 21, 2020
- International Business Machines Corporation
- Donald F. Canaperi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20200144187
- Publication date May 7, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Microcooler
- Publication number 20200118904
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Donald F. Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Microcooler
- Publication number 20200051886
- Publication date Feb 13, 2020
- Donald F. Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Microcooler
- Publication number 20200051896
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Donald F. Canaperi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20190295952
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical assemblies for transmitting and manipulating optical beams
- Publication number 20050078376
- Publication date Apr 14, 2005
- Dinesh Gupta
- G02 - OPTICS
Information Patent Application
OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS
- Publication number 20040217464
- Publication date Nov 4, 2004
- International Business Machines Corporation
- Monty M. Denneau
- G02 - OPTICS
Information Patent Application
Apparatus and method for repairing electronic packages
- Publication number 20030136581
- Publication date Jul 24, 2003
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Screening mask having a stress-relieving area
- Publication number 20030004076
- Publication date Jan 2, 2003
- International Business Machines Corporation
- Evelyn Barrington
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Mask and screening method for double pass screening
- Publication number 20020157546
- Publication date Oct 31, 2002
- International Business Machines Corporation
- Jeffrey A. Brody
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Pre-patterned substrate layers for being personalized as needed
- Publication number 20020023779
- Publication date Feb 28, 2002
- Dinesh Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR SCREENING FEATURES ON AN ELECTRONIC SUBSTRATE WITH A LO...
- Publication number 20020009539
- Publication date Jan 24, 2002
- JON A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS

Dinesh Gupta

Person

Patents Grantslast 30 patents

Three-dimensional microelectronic package with embedded cooling cha...

Direct bonded heterogeneous integration packaging structures

Semiconductor microcooler

Semiconductor wafer having trenches with varied dimensions for mult...

Semiconductor microcooler

Planar wafer level fan-out of multi-chip modules having different s...

Three-dimensional microelectronic package with embedded cooling cha...

Direct bonded heterogeneous integration packaging structures

Semiconductor microcooler

Semiconductor microcooler

Copper microcooler structure and fabrication

Copper microcooler structure and fabrication

Optical assemblies for transmitting and manipulating optical beams

Optical assemblies for transmitting and manipulating optical beams

Apparatus and method for repairing electronic packages

Screening mask having a stress-relieving area

Screening method for double pass screening

Process for screening features on an electronic substrate with a lo...

Pre-patterned substrate layers for being personalized as needed

Method of making a multilayer ceramic product with thin layers

Method of forming a multilayer ceramic substrate with max-punched vias

Multilayer ceramic substrates having internal capacitor, and proces...

Method for making ceramic substrates from thin and thick ceramic gr...

Process for producing circuitized layers and multilayer ceramic sub...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MICROELECTRONIC PACKAGE WITH EMBEDDED COOLING CHA...

PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT S...

SEMICONDUCTOR WAFER HAVING TRENCHES WITH VARIED DIMENSIONS FOR MULT...

THREE-DIMENSIONAL MICROELECTRONIC PACKAGE WITH EMBEDDED COOLING CHA...

Semiconductor Microcooler

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

Semiconductor Microcooler

Semiconductor Microcooler

Semiconductor Microcooler

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

Optical assemblies for transmitting and manipulating optical beams

OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS

Apparatus and method for repairing electronic packages

Screening mask having a stress-relieving area

Mask and screening method for double pass screening

Pre-patterned substrate layers for being personalized as needed

PROCESS FOR SCREENING FEATURES ON AN ELECTRONIC SUBSTRATE WITH A LO...