Ding Y. S. Day

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming self-aligned t-shaped transistor electrode
- Patent number 5,288,660
- Issue date Feb 22, 1994
- Avantek, Inc.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid wafer thinning process
- Patent number 5,127,984
- Issue date Jul 7, 1992
- Avantek, Inc.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the simultaneous formation of via-holes and wraparound p...
- Patent number 4,978,639
- Issue date Dec 18, 1990
- Avantek, Inc.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selective via-hole and heat sink plating using a metal mask
- Patent number 4,842,699
- Issue date Jun 27, 1989
- Avantek, Inc.
- Chang-Hwang Hua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming completely metallized via holes in semiconductors
- Patent number 4,808,273
- Issue date Feb 28, 1989
- Avantek, Inc.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS