Dingfang Li

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Dongguan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation apparatus and server
- Patent number 11,647,608
- Issue date May 9, 2023
- Huawei Technologies Co., Ltd.
- Yiying Jian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical part for fastening processor, assembly, and computer device
- Patent number 11,133,239
- Issue date Sep 28, 2021
- Huawei Technologies Co., Ltd.
- Yonghai Mao
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION APPARATUS AND SERVER
- Publication number 20240389262
- Publication date Nov 21, 2024
- Huawei Technologies Co., Ltd
- Dingfang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device Node and Liquid Cooling Cabinet
- Publication number 20240324146
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Hui Jia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK AND ELECTRONIC DEVICE
- Publication number 20230239995
- Publication date Jul 27, 2023
- Huawei Technologies Co., Ltd
- Hui JIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS AND SERVER
- Publication number 20220015268
- Publication date Jan 13, 2022
- Huawei Technologies Co., Ltd
- Yiying JIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mechanical Part for Fastening Processor, Assembly, and Computer Device
- Publication number 20200126889
- Publication date Apr 23, 2020
- Huawei Technologies Co., Ltd
- Yonghai Mao
- G06 - COMPUTING CALCULATING COUNTING