Dingwei Xia

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for molding a semiconductor wafer and process therefor
- Patent number 9,524,885
- Issue date Dec 20, 2016
- Advanced Systems Automation Ltd.
- Jimmy Chew Hwee Seng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for molding a semiconductor wafer and process therefor
- Patent number 8,791,583
- Issue date Jul 29, 2014
- Advanced Systems Automation Ltd.
- Hwee Seng Jimmy Chew
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR MOLDING A SEMICONDUCTOR WAFER AND PROCESS THEREFOR
- Publication number 20140333006
- Publication date Nov 13, 2014
- Jimmy Chew Hwee Seng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and apparatus for forming a flip chip semiconductor package...
- Publication number 20050106784
- Publication date May 19, 2005
- Dingwei Xia
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Apparatus for molding a semiconductor wafer and process therefor
- Publication number 20050064065
- Publication date Mar 24, 2005
- Jimmy Chew Hwee Seng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL