Dipak Sengupta

Person

Boxborough, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated gesture sensor module
- Patent number 10,884,551
- Issue date Jan 5, 2021
- Analog Devices, Inc.
- Dipak Sengupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged devices with integrated antennas
- Patent number 10,593,634
- Issue date Mar 17, 2020
- Analog Devices, Inc.
- Youn-Jae Kook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with composite substrate
- Patent number 10,490,510
- Issue date Nov 26, 2019
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microphone module with sound pipe
- Patent number 10,257,610
- Issue date Apr 9, 2019
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated device packages having a MEMS die sealed in a cavity by...
- Patent number 9,731,959
- Issue date Aug 15, 2017
- Analog Devices, Inc.
- Dipak Sengupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cavity package with composite substrate
- Patent number 9,728,510
- Issue date Aug 8, 2017
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated optical sensor module
- Patent number 9,716,193
- Issue date Jul 25, 2017
- Analog Devices, Inc.
- Dipak Sengupta
- G02 - OPTICS
Information Patent Grant
Microphone module with sound pipe
- Patent number 9,173,015
- Issue date Oct 27, 2015
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packages and methods for packaging
- Patent number 9,142,470
- Issue date Sep 22, 2015
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone module with sound pipe
- Patent number 8,767,982
- Issue date Jul 1, 2014
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packages and methods for packaging using a lid having multiple cond...
- Patent number 8,723,308
- Issue date May 13, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Computed tomography detector module
- Patent number 8,553,834
- Issue date Oct 8, 2013
- Analog Devices, Inc.
- Alain Valentin Guery
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Optical package and related methods
- Patent number 8,538,215
- Issue date Sep 17, 2013
- Analog Devices, Inc.
- Shrenik Deliwala
- G02 - OPTICS
Information Patent Grant
Stress free package and laminate-based isolator package
- Patent number 7,871,865
- Issue date Jan 18, 2011
- Analog Devices, Inc.
- Dipak Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover cap for semiconductor wafer devices
- Patent number 6,534,340
- Issue date Mar 18, 2003
- Analog Devices, Inc.
- Maurice S. Karpman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED DEVICES WITH INTEGRATED ANTENNAS
- Publication number 20180190600
- Publication date Jul 5, 2018
- Analog Devices, Inc.
- Youn-Jae Kook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGE WITH COMPOSITE SUBSTRATE
- Publication number 20180047675
- Publication date Feb 15, 2018
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPHONE MODULE WITH SOUND PIPE
- Publication number 20170215001
- Publication date Jul 27, 2017
- InvenSense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAVITY PACKAGE WITH COMPOSITE SUBSTRATE
- Publication number 20160300781
- Publication date Oct 13, 2016
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES FOR STRESS-SENSITIVE DEVICE DIES
- Publication number 20160090298
- Publication date Mar 31, 2016
- Dipak Sengupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE MODULE WITH SOUND PIPE
- Publication number 20160044409
- Publication date Feb 11, 2016
- InvenSense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED GESTURE SENSOR MODULE
- Publication number 20140340302
- Publication date Nov 20, 2014
- Analog Devices, Inc.
- Dipak Sengupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20140332947
- Publication date Nov 13, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE MODULE WITH SOUND PIPE
- Publication number 20140294221
- Publication date Oct 2, 2014
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPUTED TOMOGRAPHY DETECTOR MODULE
- Publication number 20140016739
- Publication date Jan 16, 2014
- Analog Devices, Inc.
- Alain Valentin GUERY
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED OPTICAL SENSOR MODULE
- Publication number 20130292786
- Publication date Nov 7, 2013
- Analog Devices, Inc.
- Dipak Sengupta
- G02 - OPTICS
Information Patent Application
Microphone Module with Sound Pipe
- Publication number 20130129136
- Publication date May 23, 2013
- Analog Devices, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20120126347
- Publication date May 24, 2012
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPUTED TOMOGRAPHY DETECTOR MODULE
- Publication number 20120069956
- Publication date Mar 22, 2012
- Analog Devices, Inc.
- Alain Valentin GUERY
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
OPTICAL PACKAGE AND RELATED METHODS
- Publication number 20110286690
- Publication date Nov 24, 2011
- Shrenik Deliwala
- G02 - OPTICS
Information Patent Application
Molded Sensor Package and Assembly Method
- Publication number 20090134481
- Publication date May 28, 2009
- Analog Devices, Inc.
- Dipak Sengupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS FREE PACKAGE AND LAMINATE-BASED ISOLATOR PACKAGE
- Publication number 20080176362
- Publication date Jul 24, 2008
- Dipak Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microphone System with Silicon Microphone Secured to Package Lid
- Publication number 20080175425
- Publication date Jul 24, 2008
- Analog Devices, Inc.
- Carl M. Roberts
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SINGLE PACKAGE DETECTOR AND DIGITAL CONVERTER INTEGRATION
- Publication number 20080001246
- Publication date Jan 3, 2008
- Dipak Sengupta
- H01 - BASIC ELECTRIC ELEMENTS

Dipak Sengupta

Person

Patents Grantslast 30 patents

Integrated gesture sensor module

Packaged devices with integrated antennas

Cavity package with composite substrate

Microphone module with sound pipe

Integrated device packages having a MEMS die sealed in a cavity by...

Cavity package with composite substrate

Integrated optical sensor module

Microphone module with sound pipe

Packages and methods for packaging

Microphone module with sound pipe

Packages and methods for packaging using a lid having multiple cond...

Computed tomography detector module

Optical package and related methods

Stress free package and laminate-based isolator package

Cover cap for semiconductor wafer devices

Patents Applicationslast 30 patents

PACKAGED DEVICES WITH INTEGRATED ANTENNAS

CAVITY PACKAGE WITH COMPOSITE SUBSTRATE

MICROPHONE MODULE WITH SOUND PIPE

CAVITY PACKAGE WITH COMPOSITE SUBSTRATE

PACKAGES FOR STRESS-SENSITIVE DEVICE DIES

MICROPHONE MODULE WITH SOUND PIPE

INTEGRATED GESTURE SENSOR MODULE

PACKAGES AND METHODS FOR PACKAGING

MICROPHONE MODULE WITH SOUND PIPE

COMPUTED TOMOGRAPHY DETECTOR MODULE

INTEGRATED OPTICAL SENSOR MODULE

Microphone Module with Sound Pipe

PACKAGES AND METHODS FOR PACKAGING

COMPUTED TOMOGRAPHY DETECTOR MODULE

OPTICAL PACKAGE AND RELATED METHODS

Molded Sensor Package and Assembly Method

STRESS FREE PACKAGE AND LAMINATE-BASED ISOLATOR PACKAGE

Microphone System with Silicon Microphone Secured to Package Lid

SINGLE PACKAGE DETECTOR AND DIGITAL CONVERTER INTEGRATION