Dipl.-Ing. Florian Bieck

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Mainz, DE

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Patents Grantslast 30 patents

Information Patent Grant
Process for making contact with and housing integrated circuits
- Patent number 8,349,707
- Issue date Jan 8, 2013
- Wafer-Level Packaging Portfolio LLC
- Dipl.-Ing. Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making contact with and housing integrated circuits
- Patent number 7,880,179
- Issue date Feb 1, 2011
- Wafer-Level Packaging Portfolio LLC
- Dipl.-Ing. Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process for Making Contact with and Housing Integrated Circuits
- Publication number 20110021002
- Publication date Jan 27, 2011
- Dipl.-Ing. Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS
- Publication number 20100065883
- Publication date Mar 18, 2010
- Schott AG
- Dipl.-Ing. Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing microelectromechanical components
- Publication number 20040214380
- Publication date Oct 28, 2004
- Jurgen Leib
- B81 - MICRO-STRUCTURAL TECHNOLOGY