Dirk Karl Manger

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Poughkeepsie, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,593,660
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,261,951
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Publication number 20010053591
- Publication date Dec 20, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS