Dirk Rohde

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 12,071,702
- Issue date Aug 27, 2024
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bath and method for filling a vertical interconnect access or trenc...
- Patent number 11,091,849
- Issue date Aug 17, 2021
- Atotech Deutschland GmbH
- Josef Gaida
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 11,035,051
- Issue date Jun 15, 2021
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Aqueous indium or indium alloy plating bath and process for deposit...
- Patent number 10,793,962
- Issue date Oct 6, 2020
- Atotech Deutschland GmbH
- Jan Sperling
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for indium or indium alloy deposition and article
- Patent number 10,753,007
- Issue date Aug 25, 2020
- Atotech Deutschland GmbH
- Grigory Vazhenin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper plating bath composition and method for deposition of copper
- Patent number 10,633,755
- Issue date Apr 28, 2020
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper plating bath compositions and a method for thei...
- Patent number 10,538,850
- Issue date Jan 21, 2020
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper plating bath composition
- Patent number 9,551,080
- Issue date Jan 24, 2017
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for copper plating
- Patent number 9,506,158
- Issue date Nov 29, 2016
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Aqueous, acid bath and method for the electrolytic deposition of co...
- Patent number 8,679,316
- Issue date Mar 25, 2014
- Atotech Deutschland GmbH
- Heiko Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
- Publication number 20210262105
- Publication date Aug 26, 2021
- Atotech Deutschland GmbH
- Kun SI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AQUEOUS INDIUM OR INDIUM ALLOY PLATING BATH AND PROCESS FOR DEPOSIT...
- Publication number 20200392637
- Publication date Dec 17, 2020
- Atotech Deutschland GmbH
- Jan SPERLING
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
A BATH AND METHOD FOR FILLING A VERTICAL INTERCONNECT ACCESS OR TRE...
- Publication number 20200199766
- Publication date Jun 25, 2020
- Atotech Deutschland GmbH
- Josef GAIDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
- Publication number 20190203369
- Publication date Jul 4, 2019
- Atotech Deutschland GmbH
- Kun SI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AQUEOUS INDIUM OR INDIUM ALLOY PLATING BATH AND PROCESS FOR DEPOSIT...
- Publication number 20180355500
- Publication date Dec 13, 2018
- Atotech Deutschland GmbH
- Jan SPERLING
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR INDIUM OR INDIUM ALLOY DEPOSITION AND ARTICLE
- Publication number 20180298511
- Publication date Oct 18, 2018
- Atotech Deutschland GmbH
- Grigory VAZHENIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER
- Publication number 20180237932
- Publication date Aug 23, 2018
- Atotech Deutschland GmbH
- Dirk ROHDE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER PLATING BATH COMPOSITIONS AND A METHOD FOR THEI...
- Publication number 20180112320
- Publication date Apr 26, 2018
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PLATING BATH COMPOSITION
- Publication number 20150299883
- Publication date Oct 22, 2015
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR COPPER PLATING
- Publication number 20140102910
- Publication date Apr 17, 2014
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Aqueous, Acid Bath and Method for the Electrolytic Deposition of Co...
- Publication number 20110011746
- Publication date Jan 20, 2011
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

Acidic aqueous composition for electrolytic copper plating

Bath and method for filling a vertical interconnect access or trenc...

Acidic aqueous composition for electrolytic copper plating

Aqueous indium or indium alloy plating bath and process for deposit...

Process for indium or indium alloy deposition and article

Copper plating bath composition and method for deposition of copper

Electrolytic copper plating bath compositions and a method for thei...

Copper plating bath composition

Method for copper plating

Aqueous, acid bath and method for the electrolytic deposition of co...

Patents Applicationslast 30 patents

ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING

AQUEOUS INDIUM OR INDIUM ALLOY PLATING BATH AND PROCESS FOR DEPOSIT...

A BATH AND METHOD FOR FILLING A VERTICAL INTERCONNECT ACCESS OR TRE...

ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING

AQUEOUS INDIUM OR INDIUM ALLOY PLATING BATH AND PROCESS FOR DEPOSIT...

PROCESS FOR INDIUM OR INDIUM ALLOY DEPOSITION AND ARTICLE

COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER

ELECTROLYTIC COPPER PLATING BATH COMPOSITIONS AND A METHOD FOR THEI...

COPPER PLATING BATH COMPOSITION

METHOD FOR COPPER PLATING

Aqueous, Acid Bath and Method for the Electrolytic Deposition of Co...