Dirk Tews

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a printed circuit board
- Patent number 10,477,700
- Issue date Nov 12, 2019
- Atotech Deutschland GmbH
- Wonjin Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aqueous composition for etching of copper and copper alloys
- Patent number 9,441,304
- Issue date Sep 13, 2016
- Atotech Deutschland GmbH
- Norbert Lützow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for etching a recessed structure filled with tin or a tin a...
- Patent number 9,332,652
- Issue date May 3, 2016
- Atotech Deutschland GmbH
- Neal Wood
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Non-etching non-resist adhesion composition and method of preparing...
- Patent number 8,945,298
- Issue date Feb 3, 2015
- Atotech Deutschland GmbH
- Christian Sparing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition and method for micro etching of copper and copper alloys
- Patent number 8,758,634
- Issue date Jun 24, 2014
- Atotech Deutschland GmbH
- Dirk Tews
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition and method for improved adhesion of polymeric materials...
- Patent number 8,192,636
- Issue date Jun 5, 2012
- Atotech Deutschland GmbH
- Dirk Tews
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
COMPOSTION FOR DEPOSITING A PALLADIUM COATING ON A SUBSTRATE
- Publication number 20230323542
- Publication date Oct 12, 2023
- Atotech Deutschland GmbH & Co. KG
- Donny LAUTAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPP...
- Publication number 20210251085
- Publication date Aug 12, 2021
- Atotech Deutschland GmbH
- Norbert LÜTZOW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20190297732
- Publication date Sep 26, 2019
- Atotech Deutschland GmbH
- Wonjin CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20170275767
- Publication date Sep 28, 2017
- Atotech Deutschland GmbH
- Markku LAGER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20150307999
- Publication date Oct 29, 2015
- Atotech Deutschland GmbH
- Norbert LÜTZOW
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND MET...
- Publication number 20150050422
- Publication date Feb 19, 2015
- Atotech Deutschland GmbH
- Dirk Tews
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER...
- Publication number 20140141169
- Publication date May 22, 2014
- Atotech Deutschland GmbH
- Thomas Huelsmann
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PROCESS FOR ETCHING A RECESSED STRUCTURE FILLED WITH TIN OR A TIN A...
- Publication number 20140000650
- Publication date Jan 2, 2014
- Atotech Deutschland GmbH
- Neal Wood
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20130056438
- Publication date Mar 7, 2013
- Atotech Deutschland GmbH
- Dirk Tews
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Manufacturing a Circuit Carrier Layer and a Use of Said M...
- Publication number 20120118753
- Publication date May 17, 2012
- Atotech Deutschland GmbH
- Norbert Lützow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-Etching Non-Resist Adhesion Composition and Method of Preparing...
- Publication number 20100323099
- Publication date Dec 23, 2010
- Atotech Deutschland GmbH
- Christian Sparing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Composition and Method for Improved Adhesion of Polymeric Materials...
- Publication number 20100035435
- Publication date Feb 11, 2010
- Atotech Deutschland GmbH
- Dirk Tews
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Method for manufacturing a printed circuit board

Aqueous composition for etching of copper and copper alloys

Process for etching a recessed structure filled with tin or a tin a...

Non-etching non-resist adhesion composition and method of preparing...

Composition and method for micro etching of copper and copper alloys

Composition and method for improved adhesion of polymeric materials...

Patents Applicationslast 30 patents

COMPOSTION FOR DEPOSITING A PALLADIUM COATING ON A SUBSTRATE

A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPP...

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD

COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS

AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS

METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND MET...

METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER...

PROCESS FOR ETCHING A RECESSED STRUCTURE FILLED WITH TIN OR A TIN A...

COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS

Method of Manufacturing a Circuit Carrier Layer and a Use of Said M...

Non-Etching Non-Resist Adhesion Composition and Method of Preparing...

Composition and Method for Improved Adhesion of Polymeric Materials...