Divya MANI

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded substrate heat sink for bottom side cooling
- Patent number 11,830,783
- Issue date Nov 28, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for cored substrates
- Patent number 11,640,929
- Issue date May 2, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid thermal interface material in electronic packaging
- Patent number 11,581,240
- Issue date Feb 14, 2023
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
5G mmWave cooling through PCB
- Patent number 11,112,841
- Issue date Sep 7, 2021
- Intel Corporation
- Divya Mani
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
5G mmWAVE COOLING THROUGH PCB
- Publication number 20220256715
- Publication date Aug 11, 2022
- Intel Corporation
- Divya MANI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUBSTRATE COOLING USING HEAT PIPE VAPOR CHAMBER STIFFENER AND IHS LEGS
- Publication number 20210259134
- Publication date Aug 19, 2021
- Intel Corporation
- Aastha UPPAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED SUBSTRATE HEAT SINK FOR BOTTOM SIDE COOLING
- Publication number 20210111091
- Publication date Apr 15, 2021
- Intel Corporation
- Aastha UPPAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USIN...
- Publication number 20200219789
- Publication date Jul 9, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID THERMAL INTERFACE MATERIAL IN ELECTRONIC PACKAGING
- Publication number 20200203254
- Publication date Jun 25, 2020
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR CORED SUBSTRATES
- Publication number 20200203256
- Publication date Jun 25, 2020
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
5G mmWAVE COOLING THROUGH PCB
- Publication number 20190377392
- Publication date Dec 12, 2019
- Intel Corporation
- Divya MANI
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Embedded substrate heat sink for bottom side cooling

Thermal management solutions for cored substrates

Liquid thermal interface material in electronic packaging

5G mmWave cooling through PCB

Patents Applicationslast 30 patents

5G mmWAVE COOLING THROUGH PCB

SUBSTRATE COOLING USING HEAT PIPE VAPOR CHAMBER STIFFENER AND IHS LEGS

EMBEDDED SUBSTRATE HEAT SINK FOR BOTTOM SIDE COOLING

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USIN...

LIQUID THERMAL INTERFACE MATERIAL IN ELECTRONIC PACKAGING

THERMAL MANAGEMENT SOLUTIONS FOR CORED SUBSTRATES

5G mmWAVE COOLING THROUGH PCB