Do Joon YOO

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Reprint apparatus for circuit board and reprint method using the same
- Patent number 12,262,477
- Issue date Mar 25, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and camera device comprising same
- Patent number 12,144,103
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Do Hyuk Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable body fat combustion measurement device
- Patent number 11,717,216
- Issue date Aug 8, 2023
- SENTECH KOREA CORP.
- Do Joon Yoo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Body fat combustion amount measurement device
- Patent number 11,484,259
- Issue date Nov 1, 2022
- SENTECH GMI CORP.
- Do Joon Yoo
- G01 - MEASURING TESTING
Information Patent Grant
Image sensor package including reflector
- Patent number 11,387,270
- Issue date Jul 12, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic component module
- Patent number 10,667,419
- Issue date May 26, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device module and method of manufacturing the same
- Patent number 10,356,911
- Issue date Jul 16, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device module and manufacturing method thereof
- Patent number 10,219,380
- Issue date Feb 26, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved signal stability and method of...
- Patent number 10,163,746
- Issue date Dec 25, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong In Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided package module and substrate strip
- Patent number 10,109,595
- Issue date Oct 23, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and manufacturing method thereof
- Patent number 9,894,790
- Issue date Feb 13, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of manufacturing the same
- Patent number 9,748,179
- Issue date Aug 29, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device module and manufacturing method thereof
- Patent number 9,633,923
- Issue date Apr 25, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and manufacturing method thereof
- Patent number 9,585,260
- Issue date Feb 28, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,508,565
- Issue date Nov 29, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an antenna formed in a groove withi...
- Patent number 9,496,219
- Issue date Nov 15, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,343,391
- Issue date May 17, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyu Hwan Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with integrated antenna for wireless a...
- Patent number 9,245,858
- Issue date Jan 26, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Woo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a conductive shielding member
- Patent number 9,209,101
- Issue date Dec 8, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do-Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package with a fastening unit including a non-conducti...
- Patent number 9,209,114
- Issue date Dec 8, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method for manufacturing the same
- Patent number 9,202,798
- Issue date Dec 1, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Unit power module and power module package comprising the same
- Patent number 9,123,683
- Issue date Sep 1, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 9,105,601
- Issue date Aug 11, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 9,076,660
- Issue date Jul 7, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 9,048,199
- Issue date Jun 2, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Do-Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation system for power module
- Patent number 9,030,823
- Issue date May 12, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic component package and manufacturing method thereof
- Patent number 8,779,580
- Issue date Jul 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal pin
- Patent number D708578
- Issue date Jul 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae Yoo
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Terminal pin
- Patent number D708139
- Issue date Jul 1, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae Yoo
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240365475
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20240098884
- Publication date Mar 21, 2024
- LG Innotek Co., Ltd.
- Do Hyuk YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240074065
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240032201
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220346236
- Publication date Oct 27, 2022
- LG Innotek Co., Ltd.
- Eui Yeol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220264750
- Publication date Aug 18, 2022
- LG Innotek Co., Ltd.
- Do Hyuk YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND CAMERA DEVICE COMPRISING SAME
- Publication number 20210267043
- Publication date Aug 26, 2021
- LG INNOTEK CO., LTD.
- Do Hyuk YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20200395396
- Publication date Dec 17, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20200350351
- Publication date Nov 5, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE BODY FAT COMBUSTION MEASUREMENT DEVICE
- Publication number 20200155064
- Publication date May 21, 2020
- SENTECH KOREA CORP.
- Do Joon YOO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MEASURING DEVICE FOR AMOUNT OF BODY FAT BURNED
- Publication number 20200138370
- Publication date May 7, 2020
- SENTECH GMI CORP.
- Do Joon YOO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20180110147
- Publication date Apr 19, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170301632
- Publication date Oct 19, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED PACKAGE MODULE AND SUBSTRATE STRIP
- Publication number 20170221835
- Publication date Aug 3, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ANTENNA FORMED IN A GROOVE WITHI...
- Publication number 20170018513
- Publication date Jan 19, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160315027
- Publication date Oct 27, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jong In RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED ANTENNA FOR WIRELESS A...
- Publication number 20160126200
- Publication date May 5, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Myeong Woo HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160035678
- Publication date Feb 4, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160021737
- Publication date Jan 21, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kyu Hwan OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160020171
- Publication date Jan 21, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160007463
- Publication date Jan 7, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20150289392
- Publication date Oct 8, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150228625
- Publication date Aug 13, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20150223361
- Publication date Aug 6, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20150181708
- Publication date Jun 25, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jong In Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150137339
- Publication date May 21, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kyu Hwan OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20150136451
- Publication date May 21, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Heung Woo PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20150131235
- Publication date May 14, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20150131231
- Publication date May 14, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150115443
- Publication date Apr 30, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kyu Hwan OH
- H01 - BASIC ELECTRIC ELEMENTS

Do Joon YOO

Person

Patents Grantslast 30 patents

Reprint apparatus for circuit board and reprint method using the same

Printed circuit board

Printed circuit board and camera device comprising same

Wearable body fat combustion measurement device

Body fat combustion amount measurement device

Image sensor package including reflector

Manufacturing method of an electronic component module

Electronic device module and method of manufacturing the same

Electronic device module and manufacturing method thereof

Semiconductor package with improved signal stability and method of...

Double-sided package module and substrate strip

Electronic component module and manufacturing method thereof

Package and method of manufacturing the same

Electronic device module and manufacturing method thereof

Electronic component module and manufacturing method thereof

Semiconductor package and method of manufacturing the same

Semiconductor package including an antenna formed in a groove withi...

Semiconductor package and method of manufacturing the same

Semiconductor device package with integrated antenna for wireless a...

Semiconductor package with a conductive shielding member

Power module package with a fastening unit including a non-conducti...

Power module package and method for manufacturing the same

Unit power module and power module package comprising the same

Power module package

Power module package

Semiconductor package and method of manufacturing the semiconductor...

Heat dissipation system for power module

Electronic component package and manufacturing method thereof

Terminal pin

Terminal pin

Patents Applicationslast 30 patents

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND CAMERA DEVICE COMPRISING SAME

IMAGE SENSOR PACKAGE

IMAGE SENSOR PACKAGE

WEARABLE BODY FAT COMBUSTION MEASUREMENT DEVICE

MEASURING DEVICE FOR AMOUNT OF BODY FAT BURNED

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

PACKAGE AND METHOD OF MANUFACTURING THE SAME

DOUBLE-SIDED PACKAGE MODULE AND SUBSTRATE STRIP

SEMICONDUCTOR PACKAGE INCLUDING AN ANTENNA FORMED IN A GROOVE WITHI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED ANTENNA FOR WIRELESS A...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT MODULE

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE