Doau-Tzu Wang

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Toayuan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,084,341
- Issue date Jul 14, 2015
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate and fabrication method thereof
- Patent number 8,698,008
- Issue date Apr 15, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a package substrate
- Patent number 8,628,636
- Issue date Jan 14, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20140174644
- Publication date Jun 26, 2014
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PACKAGE SUBSTRATE
- Publication number 20130180651
- Publication date Jul 18, 2013
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20130146336
- Publication date Jun 13, 2013
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS