Domingo A. Ferrer

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure with niobium-based silicide layer and...
- Patent number 11,239,336
- Issue date Feb 1, 2022
- GLOBALFOUNDRIES U.S. INC.
- Wei Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer formation
- Patent number 10,319,633
- Issue date Jun 11, 2019
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified tungsten silicon
- Patent number 10,192,822
- Issue date Jan 29, 2019
- GLOBALFOUNDRIES Inc.
- Domingo A. Ferrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer formation
- Patent number 10,170,359
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified tungsten silicon
- Patent number 10,096,609
- Issue date Oct 9, 2018
- GLOBALFOUNDRIES Inc.
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple step thin film deposition method for high conformality
- Patent number 9,859,403
- Issue date Jan 2, 2018
- GLOBALFOUNDRIES Inc.
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer formation
- Patent number 9,847,251
- Issue date Dec 19, 2017
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact fill in an integrated circuit
- Patent number 9,691,658
- Issue date Jun 27, 2017
- GLOBALFOUNDRIES Inc.
- Emre Alptekin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless metallization contacts
- Patent number 9,633,946
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer formation
- Patent number 9,406,554
- Issue date Aug 2, 2016
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardmask removal for copper interconnects with tungsten contacts by...
- Patent number 9,293,365
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Domingo A. Ferrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic capacitance tuning for robust middle of the line contact...
- Patent number 9,224,675
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Patrick W. DeHaven
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-SILICIDE STACKED FIELD-EFFECT TRANSISTORS
- Publication number 20250031440
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Domingo Ferrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS
- Publication number 20240429166
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR HIGH ASPECT RATIO PATTERNING
- Publication number 20240332295
- Publication date Oct 3, 2024
- International Business Machines Corporation
- DOMINGO FERRER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH NIOBIUM-BASED SILICIDE LAYER AND...
- Publication number 20210249518
- Publication date Aug 12, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Wei Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20180374746
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20180047622
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE STEP THIN FILM DEPOSITION METHOD FOR HIGH CONFORMALITY
- Publication number 20180026118
- Publication date Jan 25, 2018
- GLOBALFOUNDRIES INC.
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20160276217
- Publication date Sep 22, 2016
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20160268161
- Publication date Sep 15, 2016
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED TUNGSTEN SILICON
- Publication number 20160240478
- Publication date Aug 18, 2016
- GLOBALFOUNDRIES Inc.
- Domingo A. Ferrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED TUNGSTEN SILICON
- Publication number 20160240438
- Publication date Aug 18, 2016
- GLOBALFOUNDRIES INC.
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20160093526
- Publication date Mar 31, 2016
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK REMOVAL FOR COPPER INTERCONNECTS WITH TUNGSTEN CONTACTS BY...
- Publication number 20150279733
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Domingo A. Ferrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT IN A DEP-ETCH-DEP PROCESS
- Publication number 20150111374
- Publication date Apr 23, 2015
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS

Domingo A. Ferrer

Person

Patents Grantslast 30 patents

Integrated circuit structure with niobium-based silicide layer and...

Diffusion barrier layer formation

Modified tungsten silicon

Diffusion barrier layer formation

Modified tungsten silicon

Multiple step thin film deposition method for high conformality

Diffusion barrier layer formation

Contact fill in an integrated circuit

Seamless metallization contacts

Diffusion barrier layer formation

Hardmask removal for copper interconnects with tungsten contacts by...

Automatic capacitance tuning for robust middle of the line contact...

Patents Applicationslast 30 patents

MULTI-SILICIDE STACKED FIELD-EFFECT TRANSISTORS

TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS

FIELD EFFECT TRANSISTOR HIGH ASPECT RATIO PATTERNING

INTEGRATED CIRCUIT STRUCTURE WITH NIOBIUM-BASED SILICIDE LAYER AND...

DIFFUSION BARRIER LAYER FORMATION

DIFFUSION BARRIER LAYER FORMATION

MULTIPLE STEP THIN FILM DEPOSITION METHOD FOR HIGH CONFORMALITY

DIFFUSION BARRIER LAYER FORMATION

DIFFUSION BARRIER LAYER FORMATION

MODIFIED TUNGSTEN SILICON

MODIFIED TUNGSTEN SILICON

DIFFUSION BARRIER LAYER FORMATION

HARDMASK REMOVAL FOR COPPER INTERCONNECTS WITH TUNGSTEN CONTACTS BY...

SURFACE TREATMENT IN A DEP-ETCH-DEP PROCESS