Dominic J. Benvegnu

Person

La Honda, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 12,148,148
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Consumable part monitoring in chemical mechanical polisher
- Patent number 11,931,860
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Thomas H. Osterheld
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System using film thickness estimation from machine learning based...
- Patent number 11,847,776
- Issue date Dec 19, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Film thickness estimation from machine learning based processing of...
- Patent number 11,836,913
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 11,776,109
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Nojan Motamedi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Color imaging for CMP monitoring
- Patent number 11,715,193
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Endpoint detection for chemical mechanical polishing based on spect...
- Patent number 11,715,672
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Monitoring of vibrations during chemical mechanical polishing
- Patent number 11,701,749
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Boguslaw A. Swedek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging for monitoring thickness in a substrate cleaning system
- Patent number 11,699,595
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 11,682,114
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polishing system with capacitive shear sensor
- Patent number 11,660,722
- Issue date May 30, 2023
- Applied Materials, Inc.
- Nicholas Wiswell
- B24 - GRINDING POLISHING
Information Patent Grant
Machine vision as input to a CMP process control algorithm
- Patent number 11,577,356
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Benjamin Cherian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Consumable part monitoring in chemical mechanical polisher
- Patent number 11,571,786
- Issue date Feb 7, 2023
- Applied Materials, Inc.
- Thomas H. Osterheld
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 11,557,048
- Issue date Jan 17, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Residue detection using a luminance histogram
- Patent number 11,315,232
- Issue date Apr 26, 2022
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Endpointing detection for chemical mechanical polishing based on sp...
- Patent number 11,183,435
- Issue date Nov 23, 2021
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 11,100,628
- Issue date Aug 24, 2021
- Applied Materials, Inc.
- Nojan Motamedi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polishing pad with window and manufacturing methods thereof
- Patent number 11,072,050
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Boyi Fu
- B24 - GRINDING POLISHING
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 11,017,524
- Issue date May 25, 2021
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display of spectra contour plots versus time for semiconductor proc...
- Patent number 10,948,900
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Spectra based endpointing for chemical mechanical polishing
- Patent number 10,766,119
- Issue date Sep 8, 2020
- Applied Materials, Inc.
- Boguslaw A. Swedek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive monitoring of conductive loops
- Patent number 10,741,459
- Issue date Aug 11, 2020
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Color imaging for CMP monitoring
- Patent number 10,565,701
- Issue date Feb 18, 2020
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 10,325,364
- Issue date Jun 18, 2019
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Endpointing detection for chemical mechanical polishing based on sp...
- Patent number 10,276,460
- Issue date Apr 30, 2019
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Inductive monitoring of conductive trench depth
- Patent number 10,103,073
- Issue date Oct 16, 2018
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint method using peak location of spectra contour plots versus...
- Patent number 9,886,026
- Issue date Feb 6, 2018
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Peak-based endpointing for chemical mechanical polishing
- Patent number 9,799,578
- Issue date Oct 24, 2017
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Inductive monitoring of conductive trench depth
- Patent number 9,754,846
- Issue date Sep 5, 2017
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Limiting adjustment of polishing rates during substrate polishing
- Patent number 9,607,910
- Issue date Mar 28, 2017
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR FILM THICKNESS PREDICTION USING MACHINE-LEARNING
- Publication number 20240185058
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- Nojan Motamedi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED...
- Publication number 20240062364
- Publication date Feb 22, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIDUE CLASSIFICATION FROM MACHINE LEARNING BASED PROCESSING OF SU...
- Publication number 20240054634
- Publication date Feb 15, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING
- Publication number 20240017371
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER
- Publication number 20240017376
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
ACOUSTIC MONITORING OF CMP RETAINING RING
- Publication number 20230390883
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Haoquan Fang
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SYSTEM WITH CAPACITIVE SHEAR SENSOR
- Publication number 20230278164
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Application
THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY
- Publication number 20230281801
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Application
CONSUMABLE PART MONITORING IN CHEMICAL MECHANICAL POLISHER
- Publication number 20230249315
- Publication date Aug 10, 2023
- Applied Materials, Inc.
- Thomas H. Osterheld
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM
- Publication number 20230182258
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Benjamin Cherian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
USING LIGHT COUPLING PROPERTIES FOR FILM DETECTION
- Publication number 20220388111
- Publication date Dec 8, 2022
- Applied Materials, Inc.
- Nojan Motamedi
- B24 - GRINDING POLISHING
Information Patent Application
USING LIGHT COUPLING PROPERTIES FOR MACHINE-LEARNING-BASED FILM DET...
- Publication number 20220388112
- Publication date Dec 8, 2022
- Applied Materials, Inc.
- Nojan Motamedi
- B24 - GRINDING POLISHING
Information Patent Application
FOURIER FILTERING OF SPECTRAL DATA FOR MEASURING LAYER THICKNESS DU...
- Publication number 20220371152
- Publication date Nov 24, 2022
- Applied Materials, Inc.
- Benjamin Cherian
- B24 - GRINDING POLISHING
Information Patent Application
PIXEL CLASSIFICATION OF FILM NON-UNIFORMITY BASED ON PROCESSING OF...
- Publication number 20220285227
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASSIVE ACOUSTIC MONITORING AND ACOUSTIC SENSORS FOR CHEMICAL MECHA...
- Publication number 20220281057
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Application
REGION CLASSIFICATION OF FILM NON-UNIFORMITY BASED ON PROCESSING OF...
- Publication number 20220284562
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ACTIVE ACOUSTIC MONITORING FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20220281058
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Application
IMAGING FOR MONITORING THICKNESS IN A SUBSTRATE CLEANING SYSTEM
- Publication number 20220270889
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B08 - CLEANING
Information Patent Application
ENDPOINT DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECT...
- Publication number 20220077006
- Publication date Mar 10, 2022
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED PROCESSING OF...
- Publication number 20210407065
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED...
- Publication number 20210407066
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thickness Measurement of Substrate Using Color Metrology
- Publication number 20210358113
- Publication date Nov 18, 2021
- Applied Materials, Inc.
- Nojan Motamedi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLISHING PAD WITH WINDOW AND MANUFACTURING METHODS THEREOF
- Publication number 20210347005
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Boyi FU
- B24 - GRINDING POLISHING
Information Patent Application
THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY
- Publication number 20210248730
- Publication date Aug 12, 2021
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thickness Measurement of Substrate Using Color Metrology
- Publication number 20200258214
- Publication date Aug 13, 2020
- Applied Materials, Inc.
- Nojan Motamedi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COLOR IMAGING FOR CMP MONITORING
- Publication number 20200151868
- Publication date May 14, 2020
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Application
Residue Detection Using A Luminance Histogram
- Publication number 20200126211
- Publication date Apr 23, 2020
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM
- Publication number 20200094370
- Publication date Mar 26, 2020
- Applied Materials, Inc.
- Benjamin Cherian
- B24 - GRINDING POLISHING
Information Patent Application
Polishing System with Capacitive Shear Sensor
- Publication number 20200070306
- Publication date Mar 5, 2020
- Nicholas Wiswell
- B24 - GRINDING POLISHING
Information Patent Application
THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY
- Publication number 20190295239
- Publication date Sep 26, 2019
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING

Dominic J. Benvegnu

Person

Patents Grantslast 30 patents

Thickness measurement of substrate using color metrology

Consumable part monitoring in chemical mechanical polisher

System using film thickness estimation from machine learning based...

Film thickness estimation from machine learning based processing of...

Thickness measurement of substrate using color metrology

Color imaging for CMP monitoring

Endpoint detection for chemical mechanical polishing based on spect...

Monitoring of vibrations during chemical mechanical polishing

Imaging for monitoring thickness in a substrate cleaning system

Thickness measurement of substrate using color metrology

Polishing system with capacitive shear sensor

Machine vision as input to a CMP process control algorithm

Consumable part monitoring in chemical mechanical polisher

Thickness measurement of substrate using color metrology

Residue detection using a luminance histogram

Endpointing detection for chemical mechanical polishing based on sp...

Thickness measurement of substrate using color metrology

Polishing pad with window and manufacturing methods thereof

Thickness measurement of substrate using color metrology

Display of spectra contour plots versus time for semiconductor proc...

Spectra based endpointing for chemical mechanical polishing

Inductive monitoring of conductive loops

Color imaging for CMP monitoring

Thickness measurement of substrate using color metrology

Endpointing detection for chemical mechanical polishing based on sp...

Inductive monitoring of conductive trench depth

Endpoint method using peak location of spectra contour plots versus...

Peak-based endpointing for chemical mechanical polishing

Inductive monitoring of conductive trench depth

Limiting adjustment of polishing rates during substrate polishing

Patents Applicationslast 30 patents

SEMICONDUCTOR FILM THICKNESS PREDICTION USING MACHINE-LEARNING

SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED...

RESIDUE CLASSIFICATION FROM MACHINE LEARNING BASED PROCESSING OF SU...

MONITORING THICKNESS IN FACE-UP POLISHING

MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER

ACOUSTIC MONITORING OF CMP RETAINING RING

POLISHING SYSTEM WITH CAPACITIVE SHEAR SENSOR

THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY

CONSUMABLE PART MONITORING IN CHEMICAL MECHANICAL POLISHER

MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM

USING LIGHT COUPLING PROPERTIES FOR FILM DETECTION

USING LIGHT COUPLING PROPERTIES FOR MACHINE-LEARNING-BASED FILM DET...

FOURIER FILTERING OF SPECTRAL DATA FOR MEASURING LAYER THICKNESS DU...

PIXEL CLASSIFICATION OF FILM NON-UNIFORMITY BASED ON PROCESSING OF...

PASSIVE ACOUSTIC MONITORING AND ACOUSTIC SENSORS FOR CHEMICAL MECHA...

REGION CLASSIFICATION OF FILM NON-UNIFORMITY BASED ON PROCESSING OF...

ACTIVE ACOUSTIC MONITORING FOR CHEMICAL MECHANICAL POLISHING

IMAGING FOR MONITORING THICKNESS IN A SUBSTRATE CLEANING SYSTEM

ENDPOINT DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECT...

FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED PROCESSING OF...

SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED...

Thickness Measurement of Substrate Using Color Metrology

POLISHING PAD WITH WINDOW AND MANUFACTURING METHODS THEREOF

THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY

Thickness Measurement of Substrate Using Color Metrology

COLOR IMAGING FOR CMP MONITORING

Residue Detection Using A Luminance Histogram

MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM

Polishing System with Capacitive Shear Sensor

THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY