Dominik Metzler

Person

Saratoga Springs, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Subtractive patterning of interconnect structures
- Patent number 12,020,949
- Issue date Jun 25, 2024
- International Business Machines Corporation
- Dominik Metzler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Via CD controllable top via structure
- Patent number 11,923,246
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placing top vias at line ends by selective growth of via mask from...
- Patent number 11,830,807
- Issue date Nov 28, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-based memory hardmask smoothing and stress reduction
- Patent number 11,812,668
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Michael Rizzolo
Information Patent Grant
Spin on scaffold film for forming topvia
- Patent number 11,688,636
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Somnath Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device including self-aligne...
- Patent number 11,404,317
- Issue date Aug 2, 2022
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective patterning of vias with hardmasks
- Patent number 11,276,607
- Issue date Mar 15, 2022
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal surface preparation for increased alignment contrast
- Patent number 11,244,907
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Tianji Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM integration with BEOL interconnect including top via
- Patent number 11,227,892
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-based memory hardmask smoothing and stress reduction
- Patent number 11,223,008
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded MRAM device with top via
- Patent number 11,205,678
- Issue date Dec 21, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded MRAM device formation with self-aligned dielectric cap
- Patent number 11,189,783
- Issue date Nov 30, 2021
- International Business Machines Corporation
- John Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top vias over metal lines formed by a damascene process
- Patent number 11,189,527
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Timothy Mathew Philip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placing top vias at line ends by selective growth of via mask from...
- Patent number 11,189,561
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top via formation at line ends
- Patent number 11,152,261
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top via
- Patent number 11,133,260
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structurally stable self-aligned subtractive vias
- Patent number 11,094,590
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning integration scheme with trench alignment marks
- Patent number 10,879,190
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic alignment of a conductive line to a via
- Patent number 10,685,879
- Issue date Jun 16, 2020
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic photomask alignment using non-planar alignment structu...
- Patent number 10,534,276
- Issue date Jan 14, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
SHALLOW AND DEEP CONTACTS WITH STITCHING
- Publication number 20230411212
- Publication date Dec 21, 2023
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP CONTACT STRUCTURES FOR STACKED TRANSISTORS
- Publication number 20230395596
- Publication date Dec 7, 2023
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER HARDMASK FOR DEFECT REDUCTION IN EUV PATTERNING
- Publication number 20230343593
- Publication date Oct 26, 2023
- LAM RESEARCH CORPORATION
- Bhaskar NAGABHIRAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED TOP ELECTRODE CONTACT FOR MRAM EMBEDDING IN ADVANCED LOGIC...
- Publication number 20230186962
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PATTERNING OF INTERCONNECT STRUCTURES
- Publication number 20230084739
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Dominik Metzler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIA CD CONTROLLABLE TOP VIA STRUCTURE
- Publication number 20230078008
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN ON SCAFFOLD FILM FOR FORMING TOPVIA
- Publication number 20220406657
- Publication date Dec 22, 2022
- International Business Machines Corporation
- SOMNATH GHOSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMERIZATION PROTECTIVE LINER FOR REACTIVE ION ETCH IN PATTERNING
- Publication number 20220238349
- Publication date Jul 28, 2022
- LAM RESEARCH CORPORATION
- Bhaskar Nagabhirava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PATTERNING OF VIAS WITH HARDMASKS
- Publication number 20220165612
- Publication date May 26, 2022
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR-BASED MEMORY HARDMASK SMOOTHING AND STRESS REDUCTION
- Publication number 20220109099
- Publication date Apr 7, 2022
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM...
- Publication number 20220028784
- Publication date Jan 27, 2022
- International Business Machines Corporation
- Ashim DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOP VIAS OVER METAL LINES FORMED BY A DAMASCENE PROCESS
- Publication number 20210296169
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Timothy Mathew Philip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structurally Stable Self-Aligned Subtractive Vias
- Publication number 20210280465
- Publication date Sep 9, 2021
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded MRAM Device with Top Via
- Publication number 20210242277
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SURFACE PREPARATION FOR INCREASED ALIGNMENT CONTRAST
- Publication number 20210210434
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Tianji Zhou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PILLAR-BASED MEMORY HARDMASK SMOOTHING AND STRESS REDUCTION
- Publication number 20210159394
- Publication date May 27, 2021
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOP VIA
- Publication number 20210151377
- Publication date May 20, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Top Via Formation at Line Ends
- Publication number 20210125865
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MRAM DEVICE FORMATION WITH SELF-ALIGNED DIELECTRIC CAP
- Publication number 20210091301
- Publication date Mar 25, 2021
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- John Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOP VIA FORMATION AT LINE ENDS
- Publication number 20210090951
- Publication date Mar 25, 2021
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PATTERNING OF VIAS WITH HARDMASKS
- Publication number 20210082746
- Publication date Mar 18, 2021
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM...
- Publication number 20210082807
- Publication date Mar 18, 2021
- International Business Machines Corporation
- Ashim DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM INTEGRATION WITH BEOL INTERCONNECT INCLUDING TOP VIA
- Publication number 20200403032
- Publication date Dec 24, 2020
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING INTEGRATION SCHEME WITH TRENCH ALIGNMENT MARKS
- Publication number 20200350257
- Publication date Nov 5, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS

Dominik Metzler

Person

Patents Grantslast 30 patents

Subtractive patterning of interconnect structures

Via CD controllable top via structure

Placing top vias at line ends by selective growth of via mask from...

Pillar-based memory hardmask smoothing and stress reduction

Spin on scaffold film for forming topvia

Method for fabricating a semiconductor device including self-aligne...

Selective patterning of vias with hardmasks

Metal surface preparation for increased alignment contrast

MRAM integration with BEOL interconnect including top via

Pillar-based memory hardmask smoothing and stress reduction

Embedded MRAM device with top via

Embedded MRAM device formation with self-aligned dielectric cap

Self-aligned top vias over metal lines formed by a damascene process

Placing top vias at line ends by selective growth of via mask from...

Self-aligned top via formation at line ends

Self-aligned top via

Structurally stable self-aligned subtractive vias

Patterning integration scheme with trench alignment marks

Lithographic alignment of a conductive line to a via

Lithographic photomask alignment using non-planar alignment structu...

Patents Applicationslast 30 patents

SHALLOW AND DEEP CONTACTS WITH STITCHING

TOP CONTACT STRUCTURES FOR STACKED TRANSISTORS

MULTI-LAYER HARDMASK FOR DEFECT REDUCTION IN EUV PATTERNING

MODIFIED TOP ELECTRODE CONTACT FOR MRAM EMBEDDING IN ADVANCED LOGIC...

SUBTRACTIVE PATTERNING OF INTERCONNECT STRUCTURES

VIA CD CONTROLLABLE TOP VIA STRUCTURE

SPIN ON SCAFFOLD FILM FOR FORMING TOPVIA

POLYMERIZATION PROTECTIVE LINER FOR REACTIVE ION ETCH IN PATTERNING

SELECTIVE PATTERNING OF VIAS WITH HARDMASKS

PILLAR-BASED MEMORY HARDMASK SMOOTHING AND STRESS REDUCTION

PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM...

SELF-ALIGNED TOP VIAS OVER METAL LINES FORMED BY A DAMASCENE PROCESS

Structurally Stable Self-Aligned Subtractive Vias

Embedded MRAM Device with Top Via

METAL SURFACE PREPARATION FOR INCREASED ALIGNMENT CONTRAST

PILLAR-BASED MEMORY HARDMASK SMOOTHING AND STRESS REDUCTION

SELF-ALIGNED TOP VIA

Self-Aligned Top Via Formation at Line Ends

EMBEDDED MRAM DEVICE FORMATION WITH SELF-ALIGNED DIELECTRIC CAP

SELF-ALIGNED TOP VIA FORMATION AT LINE ENDS

SELECTIVE PATTERNING OF VIAS WITH HARDMASKS

PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM...

MRAM INTEGRATION WITH BEOL INTERCONNECT INCLUDING TOP VIA

PATTERNING INTEGRATION SCHEME WITH TRENCH ALIGNMENT MARKS