Dominik Werne

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Oberaegeri, CH

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for mounting a flip chip on a substrate
- Patent number 8,166,637
- Issue date May 1, 2012
- Esec AG
- Patrick Blessing
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for mounting a flip chip on a substrate
- Patent number 7,597,234
- Issue date Oct 6, 2009
- Oerlikon Assembly Equipment AG, Steinhausen
- Patrick Blessing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus For Mounting A Flip Chip On A Substrate
- Publication number 20100040449
- Publication date Feb 18, 2010
- ESEC AG
- Patrick Blessing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Device For Wetting The Bumps Of A Semiconductor Chip Wit...
- Publication number 20100019018
- Publication date Jan 28, 2010
- Damian Baumann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for mounting a flip chip on a substrate
- Publication number 20070145102
- Publication date Jun 28, 2007
- Unaxis International Trading Ltd.
- Patrick Blessing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR