Don-Gey Liu

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Molding technique for copper interconnecting wires by electrochemic...
- Patent number 7,141,269
- Issue date Nov 28, 2006
- Feng Chia University
- Don-Gey Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxygen-removing pre-process for copper interconnect grown by electr...
- Patent number 6,838,116
- Issue date Jan 4, 2005
- Feng Chia University
- Don-Gey Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Molding technique for copper interconnecting wires by electrochemic...
- Publication number 20040222558
- Publication date Nov 11, 2004
- Don-Gey Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oxygen-removing pre-process for copper interconnect grown by electr...
- Publication number 20040108221
- Publication date Jun 10, 2004
- Don-Gey Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fast diffusion recipe for silicon by NO complexes
- Publication number 20030100170
- Publication date May 29, 2003
- FENG CHIA UNIVERSITY
- Wen-Luh Yang
- H01 - BASIC ELECTRIC ELEMENTS