Don-Son Jiang

Person

Taichung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,107,055
- Issue date Oct 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and carrier thereof and method for manufacturing...
- Patent number 12,027,484
- Issue date Jul 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,764,188
- Issue date Sep 19, 2023
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,742,296
- Issue date Aug 29, 2023
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,610,850
- Issue date Mar 21, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,532,528
- Issue date Dec 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Chi-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,398,429
- Issue date Jul 26, 2022
- Siliconware Precision Industries Co., Ltd.
- Cheng Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 10,163,662
- Issue date Dec 25, 2018
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,115,712
- Issue date Oct 30, 2018
- Siliconware Precision Industries Co., Ltd.
- Shao-Chueh Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having a laminated release layer and method for f...
- Patent number 9,673,140
- Issue date Jun 6, 2017
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,646,921
- Issue date May 9, 2017
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having landless conductive traces
- Patent number 8,304,665
- Issue date Nov 6, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...
- Publication number 20240321798
- Publication date Sep 26, 2024
- SILICONWARE PRECISION INDUST RIES CO., LT D.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240234272
- Publication date Jul 11, 2024
- Siliconware Precision Industries Co., Ltd.
- Hung-Kai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240136263
- Publication date Apr 25, 2024
- Siliconware Precision Industries Co., Ltd.
- Hung-Kai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395571
- Publication date Dec 7, 2023
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230361091
- Publication date Nov 9, 2023
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307339
- Publication date Sep 28, 2023
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268262
- Publication date Aug 24, 2023
- Siliconware Precision Industries Co., Ltd.
- Li-Chu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20230187382
- Publication date Jun 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230015721
- Publication date Jan 19, 2023
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...
- Publication number 20220392861
- Publication date Dec 8, 2022
- SILICONWARE PRECISION INDUST RIES CO., LT D.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220189900
- Publication date Jun 16, 2022
- Siliconware Precision Industries Co., Ltd.
- Chia-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220181225
- Publication date Jun 9, 2022
- Siliconware Precision Industries Co., Ltd.
- Chi-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220173052
- Publication date Jun 2, 2022
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220148975
- Publication date May 12, 2022
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220093518
- Publication date Mar 24, 2022
- Siliconware Precision Industries Co., Ltd.
- Cheng Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACK STRUCTURE, METHOD FOR FABRICATING THE SAME, AND CARRI...
- Publication number 20200328142
- Publication date Oct 15, 2020
- Siliconware Precision Industries Co., Ltd.
- Don-Son Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170207104
- Publication date Jul 20, 2017
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20170048981
- Publication date Feb 16, 2017
- Siliconware Precision Industries Co., Ltd.
- Shao-Chueh Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150287671
- Publication date Oct 8, 2015
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20150187722
- Publication date Jul 2, 2015
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150102484
- Publication date Apr 16, 2015
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING LANDLESS CONDUCTIVE TRACES
- Publication number 20090283303
- Publication date Nov 19, 2009
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Don-Son Jiang

Person

Patents Grantslast 30 patents

Electronic package and fabrication method thereof

Electronic package and carrier thereof and method for manufacturing...

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and fabrication method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Fabrication method of semiconductor package

Electronic module

Package structure having a laminated release layer and method for f...

Semiconductor package and fabrication method thereof

Package substrate having landless conductive traces

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STACK STRUCTURE, METHOD FOR FABRICATING THE SAME, AND CARRI...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

Electronic Module

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE SUBSTRATE HAVING LANDLESS CONDUCTIVE TRACES