Donald D. Danielson

Person

Aloha, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 7,855,103
- Issue date Dec 21, 2010
- Intel Corporation
- Robert J. Gleixner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 7,393,772
- Issue date Jul 1, 2008
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etchant formulation for selectively removing thin films in the pres...
- Patent number 7,087,996
- Issue date Aug 8, 2006
- Intel Corporation
- Donald Danielson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 6,924,554
- Issue date Aug 2, 2005
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etchant formulation for selectively removing thin films in the pres...
- Patent number 6,749,760
- Issue date Jun 15, 2004
- Intel Corporation
- Donald Danielson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 6,683,383
- Issue date Jan 27, 2004
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a protective conductive structure on an integrate...
- Patent number 6,426,176
- Issue date Jul 30, 2002
- Intel Corporation
- Donald D. Danielson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced surface modification of low K carbon-doped oxide
- Patent number 6,417,098
- Issue date Jul 9, 2002
- Intel Corporation
- Lawrence D. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical refractory metal stripper and parts cleaning process
- Patent number 4,975,163
- Issue date Dec 4, 1990
- Intel Corporation
- Donald D. Danielson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE
- Publication number 20080227285
- Publication date Sep 18, 2008
- ROBERT J. GLEIXNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wirebond structure and method to connect to a microelectronic die
- Publication number 20050079651
- Publication date Apr 14, 2005
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etchant formulation for selectively removing thin films in the pres...
- Publication number 20040224518
- Publication date Nov 11, 2004
- Donald Danielson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wirebond structure and method to connect to a microelectronic die
- Publication number 20030205827
- Publication date Nov 6, 2003
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etchant formulation for selectively removing thin films in the pres...
- Publication number 20030082913
- Publication date May 1, 2003
- Intel Corporation
- Donald Danielson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wirebond structure and method to connect to a microelectronic die
- Publication number 20030075804
- Publication date Apr 24, 2003
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS

Donald D. Danielson

Person

Patents Grantslast 30 patents

Wirebond structure and method to connect to a microelectronic die

Wirebond structure and method to connect to a microelectronic die

Etchant formulation for selectively removing thin films in the pres...

Wirebond structure and method to connect to a microelectronic die

Etchant formulation for selectively removing thin films in the pres...

Wirebond structure and method to connect to a microelectronic die

Method of forming a protective conductive structure on an integrate...

Enhanced surface modification of low K carbon-doped oxide

Electrochemical refractory metal stripper and parts cleaning process

Patents Applicationslast 30 patents

WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE

Wirebond structure and method to connect to a microelectronic die

Etchant formulation for selectively removing thin films in the pres...

Wirebond structure and method to connect to a microelectronic die

Etchant formulation for selectively removing thin films in the pres...

Wirebond structure and method to connect to a microelectronic die