Donald E. Cooper

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Moorpark, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Thermal-contraction matched hybrid device package
- Patent number 10,374,000
- Issue date Aug 6, 2019
- Teledyne Scientific & Imaging, LLC
- Donald E. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled hybrid array and method of forming
- Patent number 9,570,428
- Issue date Feb 14, 2017
- Teledyne Scientific & Imaging, LLC
- Majid Zandian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid assembly with improved thermal performance
- Patent number 9,520,336
- Issue date Dec 13, 2016
- Teledyne Scientific & Imaging, LLC
- Majid Zandian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning hybridization method
- Patent number 9,029,259
- Issue date May 12, 2015
- Teledyne Scientific & Imaging, LLC
- Philip A. Stupar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid circuit structure and partial backfill method for improving...
- Patent number 8,440,543
- Issue date May 14, 2013
- Teledyne Scientific & Imaging, LLC
- Donald E. Cooper
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TILED HYBRID ARRAY AND METHOD OF FORMING
- Publication number 20170062396
- Publication date Mar 2, 2017
- Teledyne Scientific & Imaging, LLC
- Majid Zandian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL-CONTRACTION MATCHED HYBRID DEVICE PACKAGE
- Publication number 20150083892
- Publication date Mar 26, 2015
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Donald E. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING HYBRIDIZATION METHOD
- Publication number 20140061911
- Publication date Mar 6, 2014
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Donald E. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING HYBRIDIZATION METHOD
- Publication number 20140061838
- Publication date Mar 6, 2014
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- PHILIP A. STUPAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CIRCUIT STRUCTURE AND PARTIAL BACKFILL METHOD FOR IMPROVING...
- Publication number 20130069192
- Publication date Mar 21, 2013
- Teledyne Scientific & Imaging, LLC
- DONALD E. COOPER
- H01 - BASIC ELECTRIC ELEMENTS