Donald E. Hawk

Person

King of Prussia, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip stacking of integrated circuit devices using partial dev...
- Patent number 8,736,076
- Issue date May 27, 2014
- LSI Corporation
- Donald E. Hawk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for computing IO redistribution routing
- Patent number 8,627,256
- Issue date Jan 7, 2014
- LSI Corporation
- Donald E. Hawk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of generating a leadframe IC package model, a leadframe mode...
- Patent number 8,370,777
- Issue date Feb 5, 2013
- LSI Corporation
- Donald E. Hawk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing an integrated circuit package
- Patent number 6,790,760
- Issue date Sep 14, 2004
- Agere Systems Inc.
- Charles Cohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with improved ESD protection for no-conn...
- Patent number 6,476,472
- Issue date Nov 5, 2002
- Agere Systems Inc.
- Kerry L. Davison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having partially exposed conductive layer
- Patent number 6,465,882
- Issue date Oct 15, 2002
- Agere Systems Guardian Corp.
- Charles Cohn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Systems and Methods for Main Distribution on an Integrated Circuit
- Publication number 20160260662
- Publication date Sep 8, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Donald E. Hawk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE CONNECTION BY WAY OF BRIDGING BLOCKS
- Publication number 20140131854
- Publication date May 15, 2014
- LSI Corporation
- Donald E. Hawk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACKING OF INTEGRATED CIRCUIT DEVICES USING PARTIAL DEV...
- Publication number 20140042601
- Publication date Feb 13, 2014
- LSI Corporation
- Donald E. Hawk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF LOWERING CAPACITANCES OF CONDUCTIVE APERTURES AND AN INTE...
- Publication number 20130154109
- Publication date Jun 20, 2013
- LSI Corporation
- Ramnath Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COMPUTING IO REDISTRIBUTION ROUTING
- Publication number 20120272203
- Publication date Oct 25, 2012
- LSI Corporation
- Donald E. Hawk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR DISTRIBUTING IO IN A SEMICONDUCTOR DEVICE
- Publication number 20080061319
- Publication date Mar 13, 2008
- Agere Systems Inc.
- Parag Madhani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit having second substrate to facilitate core power...
- Publication number 20070164446
- Publication date Jul 19, 2007
- Donald E. Hawk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for integrated circuit device power distribut...
- Publication number 20050109525
- Publication date May 26, 2005
- Kerry Leeds Davison
- H01 - BASIC ELECTRIC ELEMENTS

Donald E. Hawk

Person

Patents Grantslast 30 patents

Multi-chip stacking of integrated circuit devices using partial dev...

Method for computing IO redistribution routing

Method of generating a leadframe IC package model, a leadframe mode...

Method of manufacturing an integrated circuit package

Integrated circuit package with improved ESD protection for no-conn...

Integrated circuit package having partially exposed conductive layer

Patents Applicationslast 30 patents

Systems and Methods for Main Distribution on an Integrated Circuit

MULTI-CHIP MODULE CONNECTION BY WAY OF BRIDGING BLOCKS

MULTI-CHIP STACKING OF INTEGRATED CIRCUIT DEVICES USING PARTIAL DEV...

METHOD OF LOWERING CAPACITANCES OF CONDUCTIVE APERTURES AND AN INTE...

METHOD FOR COMPUTING IO REDISTRIBUTION ROUTING

SYSTEMS AND METHODS FOR DISTRIBUTING IO IN A SEMICONDUCTOR DEVICE

Integrated circuit having second substrate to facilitate core power...

Methods and apparatus for integrated circuit device power distribut...