Donald Fowlkes

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High power ceramic on copper package
- Patent number 9,269,594
- Issue date Feb 23, 2016
- Infineon Technologies AG
- Anwar Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flange for semiconductor die
- Patent number 8,604,609
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Anwar A. Mohammed
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Flange for semiconductor die
- Patent number 8,314,487
- Issue date Nov 20, 2012
- Infineon Technologies AG
- Anwar A. Mohammed
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method of manufacturing a power transistor module and package with...
- Patent number 8,258,014
- Issue date Sep 4, 2012
- Infineon Technologies AG
- Cynthia Blair
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Open cavity leadless surface mountable package for high power RF ap...
- Patent number 8,110,915
- Issue date Feb 7, 2012
- Infineon Technologies AG
- Donald Fowlkes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power ceramic on copper package
- Patent number 8,110,445
- Issue date Feb 7, 2012
- Infineon Technologies AG
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor package with integrated bus bar
- Patent number 7,994,630
- Issue date Aug 9, 2011
- Infineon Technologies AG
- Cynthia Blair
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power amplifier
- Patent number 7,961,470
- Issue date Jun 14, 2011
- Infineon Technologies AG
- Henrik Hoyer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with gold coatings, and process for producing it
- Patent number 7,911,041
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Improved Thermal and Electrical Conductivity Between Metal Contacts
- Publication number 20240410939
- Publication date Dec 12, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flange for Semiconductor Die
- Publication number 20130037932
- Publication date Feb 14, 2013
- INFINEON TECHNOLOGIES AG
- Anwar A. Mohammed
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
High Power Ceramic on Copper Package
- Publication number 20120104582
- Publication date May 3, 2012
- INFINEON TECHNOLOGIES AG
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A POWER TRANSISTOR MODULE AND PACKAGE WITH...
- Publication number 20110258844
- Publication date Oct 27, 2011
- INFINEON TECHNOLOGIES AG
- Cynthia Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flange for Semiconductor Die
- Publication number 20110147921
- Publication date Jun 23, 2011
- Infineon Technologies North America Corp.
- Anwar A. Mohammed
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Open Cavity Leadless Surface Mountable Package for High Power RF Ap...
- Publication number 20110089529
- Publication date Apr 21, 2011
- Infineon Technologies North America Corp.
- Donald Fowlkes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Ceramic on Copper Package
- Publication number 20100283134
- Publication date Nov 11, 2010
- Infineon Technologies North America Corp.
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Transistor Package with Integrated Bus Bar
- Publication number 20100200979
- Publication date Aug 12, 2010
- Infineon Technologies North America Corp.
- Cynthia Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Amplifier
- Publication number 20080019108
- Publication date Jan 24, 2008
- Henrik Hoyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with gold coatings, and process for producing it
- Publication number 20060175691
- Publication date Aug 10, 2006
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS

Donald Fowlkes

Person

Patents Grantslast 30 patents

High power ceramic on copper package

Flange for semiconductor die

Flange for semiconductor die

Method of manufacturing a power transistor module and package with...

Open cavity leadless surface mountable package for high power RF ap...

High power ceramic on copper package

Power transistor package with integrated bus bar

Power amplifier

Semiconductor device with gold coatings, and process for producing it

Patents Applicationslast 30 patents

Improved Thermal and Electrical Conductivity Between Metal Contacts

Flange for Semiconductor Die

High Power Ceramic on Copper Package

METHOD OF MANUFACTURING A POWER TRANSISTOR MODULE AND PACKAGE WITH...

Flange for Semiconductor Die

Open Cavity Leadless Surface Mountable Package for High Power RF Ap...

High Power Ceramic on Copper Package

Power Transistor Package with Integrated Bus Bar

Power Amplifier

Semiconductor device with gold coatings, and process for producing it