Donald Paul Cunningham

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 10,068,840
- Issue date Sep 4, 2018
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay circuit structure for interconnecting light emitting semico...
- Patent number 10,070,531
- Issue date Sep 4, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 9,679,837
- Issue date Jun 13, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 9,570,376
- Issue date Feb 14, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 9,299,647
- Issue date Mar 29, 2016
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay circuit structure for interconnecting light emitting semico...
- Patent number 9,066,443
- Issue date Jun 23, 2015
- General Electric Company
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method of forming a patterned conformal structure
- Patent number 8,748,754
- Issue date Jun 10, 2014
- General Electric Company
- Christopher James Kapusta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 8,653,670
- Issue date Feb 18, 2014
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a patterned conformal structure
- Patent number 8,276,268
- Issue date Oct 2, 2012
- General Electric Company
- Christopher James Kapusta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for pre-patterned embedded chip build-up
- Patent number 8,114,708
- Issue date Feb 14, 2012
- General Electric Company
- Paul McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming isolated conformal shielding areas
- Patent number 8,115,117
- Issue date Feb 14, 2012
- General Electric Company
- Christopher James Kapusta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for stacked die embedded chip build-up
- Patent number 8,008,125
- Issue date Aug 30, 2011
- General Electric Company
- Paul Alan McConnelee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method of forming a wafer scale package
- Patent number 7,952,187
- Issue date May 31, 2011
- General Electric Company
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method of forming a low profile conformal shield
- Patent number 7,752,751
- Issue date Jul 13, 2010
- General Electric Company
- Christopher James Kapusta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...
- Publication number 20240421116
- Publication date Dec 19, 2024
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED ARTICLES THAT DEMONSTRATE MOISTURE RESISTANCE, SUITABLE FOR...
- Publication number 20230274995
- Publication date Aug 31, 2023
- Aculon, Inc.
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED ARTICLES THAT DEMONSTRATE MOISTURE RESISTANCE, SUITABLE FOR...
- Publication number 20210108091
- Publication date Apr 15, 2021
- Aculon, Inc.
- Donald Cunningham
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20170278782
- Publication date Sep 28, 2017
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20160211208
- Publication date Jul 21, 2016
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20150171036
- Publication date Jun 18, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICO...
- Publication number 20150108513
- Publication date Apr 23, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20140159213
- Publication date Jun 12, 2014
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICO...
- Publication number 20130062630
- Publication date Mar 14, 2013
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF FORMING A PATTERNED CONFORMAL STRUCTURE
- Publication number 20120069523
- Publication date Mar 22, 2012
- Christopher James Kapusta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20110316167
- Publication date Dec 29, 2011
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF FORMING ISOLATED CONFORMAL SHIELDING AREAS
- Publication number 20100319981
- Publication date Dec 23, 2010
- Christopher James Kapusta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-TEMPERATURE CAPACITORS AND METHODS OF MAKING THE SAME
- Publication number 20100244585
- Publication date Sep 30, 2010
- GENERAL ELECTRIC COMPANY
- Daniel Qi Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP
- Publication number 20100224992
- Publication date Sep 9, 2010
- Paul Alan McConnelee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF FORMING A PATTERNED CONFORMAL STRUCTURE
- Publication number 20100108370
- Publication date May 6, 2010
- Christopher James Kapusta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SYSTEM AND METHOD FOR PRE-PATTERNED EMBEDDED CHIP BUILD-UP
- Publication number 20100078797
- Publication date Apr 1, 2010
- Paul McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF FORMING A LOW PROFILE CONFORMAL SHIELD
- Publication number 20090242263
- Publication date Oct 1, 2009
- Christopher James Kapusta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD OF FORMING A WAFER SCALE PACKAGE
- Publication number 20090243081
- Publication date Oct 1, 2009
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Donald Paul Cunningham

Person

Patents Grantslast 30 patents

Electrical interconnect for an integrated circuit package and metho...

Overlay circuit structure for interconnecting light emitting semico...

Electrical interconnect for an integrated circuit package and metho...

Electrical interconnect for an integrated circuit package and metho...

Electrical interconnect for an integrated circuit package and metho...

Overlay circuit structure for interconnecting light emitting semico...

System and method of forming a patterned conformal structure

Electrical interconnect for an integrated circuit package and metho...

System and method of forming a patterned conformal structure

System and method for pre-patterned embedded chip build-up

System and method of forming isolated conformal shielding areas

System and method for stacked die embedded chip build-up

System and method of forming a wafer scale package

System and method of forming a low profile conformal shield

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...

COATED ARTICLES THAT DEMONSTRATE MOISTURE RESISTANCE, SUITABLE FOR...

COATED ARTICLES THAT DEMONSTRATE MOISTURE RESISTANCE, SUITABLE FOR...

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICO...

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICO...

SYSTEM AND METHOD OF FORMING A PATTERNED CONFORMAL STRUCTURE

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

SYSTEM AND METHOD OF FORMING ISOLATED CONFORMAL SHIELDING AREAS

HIGH-TEMPERATURE CAPACITORS AND METHODS OF MAKING THE SAME

SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP

SYSTEM AND METHOD OF FORMING A PATTERNED CONFORMAL STRUCTURE

SYSTEM AND METHOD FOR PRE-PATTERNED EMBEDDED CHIP BUILD-UP

SYSTEM AND METHOD OF FORMING A LOW PROFILE CONFORMAL SHIELD

SYSTEM AND METHOD OF FORMING A WAFER SCALE PACKAGE