Donald Stephen Bitting

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Sinking Spring, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder bump structure for flip chip semiconductor devices and metho...
- Patent number 8,507,317
- Issue date Aug 13, 2013
- Agere Systems LLC
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including hybrid frame panel
- Patent number 8,259,454
- Issue date Sep 4, 2012
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump structure for flip chip semiconductor devices and metho...
- Patent number 7,952,206
- Issue date May 31, 2011
- Agere Systems Inc.
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...
- Publication number 20140015127
- Publication date Jan 16, 2014
- AGERE SYSTEMS LLC
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20110195544
- Publication date Aug 11, 2011
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING HYBRID FRAME PANEL
- Publication number 20090255709
- Publication date Oct 15, 2009
- GENERAL ELECTRIC COMPANY
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20070069394
- Publication date Mar 29, 2007
- Agere Systems Inc.
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS