Donald T. Campbell

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Campbell, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of bumping substrates by contained paste deposition
- Patent number 5,880,017
- Issue date Mar 9, 1999
- Hewlett-Packard Co.
- Matthew K. Schwiebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making solder balls by contained paste deposition
- Patent number 5,672,542
- Issue date Sep 30, 1997
- Hewlett-Packard Company
- Matthew K. Schwiebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making solder balls by contained paste deposition
- Patent number 5,586,715
- Issue date Dec 24, 1996
- Hewlett-Packard Company
- Matthew K. Schwiebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bumping substrates by contained paste deposition
- Patent number 5,539,153
- Issue date Jul 23, 1996
- Hewlett-Packard Company
- Matthew K. Schwiebert
- H01 - BASIC ELECTRIC ELEMENTS