Donald Tiendung TRAN

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
- Patent number 11,830,863
- Issue date Nov 28, 2023
- Intel Corporation
- Suresh V. Pothukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure features to alter the shape of a socket
- Patent number 11,569,596
- Issue date Jan 31, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
- Patent number 11,217,573
- Issue date Jan 4, 2022
- Intel Corporation
- Suresh V. Pothukuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Connector for processor package
- Patent number 10,541,494
- Issue date Jan 21, 2020
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector port frame for processor package
- Patent number 10,109,940
- Issue date Oct 23, 2018
- Intel Corporation
- Thomas A. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect cable with edge finger connector
- Patent number 10,074,920
- Issue date Sep 11, 2018
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal linear edge connector
- Patent number 10,044,115
- Issue date Aug 7, 2018
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded high density card connector
- Patent number 9,929,511
- Issue date Mar 27, 2018
- Intel Corporation
- John M. Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small form factor sockets and connectors
- Patent number 9,692,147
- Issue date Jun 27, 2017
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package connector assembly
- Patent number 9,674,954
- Issue date Jun 6, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable connector
- Patent number 9,640,880
- Issue date May 2, 2017
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package-to-socket interposer
- Patent number 9,570,386
- Issue date Feb 14, 2017
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-mated edge finger connector
- Patent number 9,502,800
- Issue date Nov 22, 2016
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-array bottom-side connector using spring bias
- Patent number 9,490,560
- Issue date Nov 8, 2016
- Intel Corporation
- Gaurav Chawla
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect architecture with stacked flex cable
- Patent number 9,332,643
- Issue date May 3, 2016
- Intel Corporation
- Sanka Ganesan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit connectors
- Patent number 9,265,170
- Issue date Feb 16, 2016
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect cable with edge finger connector
- Patent number 9,118,151
- Issue date Aug 25, 2015
- Intel Corporation
- Donald T. Tran
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flexible package-to-socket interposer
- Patent number 9,076,698
- Issue date Jul 7, 2015
- Intel Corporation
- Donald T. Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Helicoil spring backing socket
- Patent number 8,956,193
- Issue date Feb 17, 2015
- Intel Corporation
- Donald Tran
- G01 - MEASURING TESTING
Information Patent Grant
Connector assembly with integrated pitch translation
- Patent number 8,915,747
- Issue date Dec 23, 2014
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket that engages a pin grid array
- Patent number 7,670,167
- Issue date Mar 2, 2010
- Intel Corporation
- Vinayak Pandey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Attaching heat sinks to printed circuit boards using preloaded spri...
- Patent number 7,518,872
- Issue date Apr 14, 2009
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power LGA socket
- Patent number 7,402,182
- Issue date Jul 22, 2008
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket that engages a pin grid array
- Patent number 7,361,044
- Issue date Apr 22, 2008
- Intel Corporation
- Vinayak Pandey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with integrated IO and power contacts
- Patent number 7,344,918
- Issue date Mar 18, 2008
- Intel Corporation
- Donald T. Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector cell having a supported conductive extension
- Patent number 7,182,634
- Issue date Feb 27, 2007
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having angled spring portions
- Patent number 7,121,838
- Issue date Oct 17, 2006
- Intel Corporation
- Brian L. DeFord
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with integrated IO and power contacts
- Patent number 7,064,422
- Issue date Jun 20, 2006
- Intel Corporation
- Donald T. Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-power double throw lever zip socket
- Patent number 6,972,213
- Issue date Dec 6, 2005
- Intel Corporation
- Donald T. Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-power LGA socket
- Patent number 6,870,251
- Issue date Mar 22, 2005
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS
- Publication number 20240355702
- Publication date Oct 24, 2024
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS
- Publication number 20240349457
- Publication date Oct 17, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKETS HAVING FINE PITCH 3D FEATURES
- Publication number 20240283197
- Publication date Aug 22, 2024
- Intel Corporation
- Saikat Mondal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS
- Publication number 20230074269
- Publication date Mar 9, 2023
- Intel Corporation
- Donald Tiendung Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...
- Publication number 20220085001
- Publication date Mar 17, 2022
- Intel Corporation
- Suresh V. POTHUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET
- Publication number 20210305731
- Publication date Sep 30, 2021
- Intel Corporation
- Steven A. KLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...
- Publication number 20210280566
- Publication date Sep 9, 2021
- Intel Corporation
- Suresh V. POTHUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
- Publication number 20210210478
- Publication date Jul 8, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR FOR PROCESSOR PACKAGE
- Publication number 20190052016
- Publication date Feb 14, 2019
- Intel Corporation
- Donald T. TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR PORT FRAME FOR PROCESSOR PACKAGE
- Publication number 20180166807
- Publication date Jun 14, 2018
- THOMAS A. BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED HIGH DENSITY CARD CONNECTOR
- Publication number 20170271818
- Publication date Sep 21, 2017
- Intel Corporation
- John M. Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal linear edge connector
- Publication number 20170187147
- Publication date Jun 29, 2017
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INTERPOSER HAVING ENCAPSULATED INTERCONNECTS
- Publication number 20170179080
- Publication date Jun 22, 2017
- Intel Corporation
- Akshay MATHKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FORM FACTOR SOCKETS AND CONNECTORS
- Publication number 20170179622
- Publication date Jun 22, 2017
- Intel Corporation
- SRIKANT NEKKANTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CABLE CONNECTOR
- Publication number 20160276759
- Publication date Sep 22, 2016
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ARCHITECTURE WITH STACKED FLEX CABLE
- Publication number 20160248210
- Publication date Aug 25, 2016
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS
- Publication number 20160181714
- Publication date Jun 23, 2016
- Intel Corporation
- GAURAV CHAWLA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR
- Publication number 20150357736
- Publication date Dec 10, 2015
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-MATED EDGE FINGER CONNECTOR
- Publication number 20150318630
- Publication date Nov 5, 2015
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PACKAGE-TO-SOCKET INTERPOSER
- Publication number 20150262916
- Publication date Sep 17, 2015
- INTEL CORPORATON
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONNECTORS
- Publication number 20150118870
- Publication date Apr 30, 2015
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR
- Publication number 20140322932
- Publication date Oct 30, 2014
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ARCHITECTURE WITH STACKED FLEX CABLE
- Publication number 20140273552
- Publication date Sep 18, 2014
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY WITH INTEGRATED PITCH TRANSLATION
- Publication number 20140273555
- Publication date Sep 18, 2014
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE CONNECTOR ASSEMBLY
- Publication number 20140268577
- Publication date Sep 18, 2014
- Rajasekaran Raja Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELICOIL SPRING BACKING SOCKET
- Publication number 20140162504
- Publication date Jun 12, 2014
- Donald Tran
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE PACKAGE-TO-SOCKET INTERPOSER
- Publication number 20140113464
- Publication date Apr 24, 2014
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET THAT ENGAGES A PIN GRID ARRAY
- Publication number 20080146065
- Publication date Jun 19, 2008
- Intel Corporation
- Vinayak Pandey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly with integrated IO and power contacts
- Publication number 20060166400
- Publication date Jul 27, 2006
- Intel Corporation
- Donald T. Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Attaching heat sinks to printed circuit boards using preloaded spri...
- Publication number 20060002089
- Publication date Jan 5, 2006
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS

Donald Tiendung TRAN

Person

Patents Grantslast 30 patents

Dual-sided co-packaged optics for high bandwidth networking applica...

Pressure features to alter the shape of a socket

Dual-sided co-packaged optics for high bandwidth networking applica...

Connector for processor package

Connector port frame for processor package

Interconnect cable with edge finger connector

Universal linear edge connector

Shielded high density card connector

Small form factor sockets and connectors

Chip package connector assembly

Cable connector

Flexible package-to-socket interposer

Double-mated edge finger connector

Multi-array bottom-side connector using spring bias

Interconnect architecture with stacked flex cable

Integrated circuit connectors

Interconnect cable with edge finger connector

Flexible package-to-socket interposer

Helicoil spring backing socket

Connector assembly with integrated pitch translation

Socket that engages a pin grid array

Attaching heat sinks to printed circuit boards using preloaded spri...

High-power LGA socket

Socket that engages a pin grid array

Electronic assembly with integrated IO and power contacts

Connector cell having a supported conductive extension

Electronic assembly having angled spring portions

Electronic assembly with integrated IO and power contacts

High-power double throw lever zip socket

High-power LGA socket

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS

DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS

SOCKETS HAVING FINE PITCH 3D FEATURES

TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS

DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...

PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET

DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

CONNECTOR FOR PROCESSOR PACKAGE

CONNECTOR PORT FRAME FOR PROCESSOR PACKAGE

SHIELDED HIGH DENSITY CARD CONNECTOR

Universal linear edge connector

SEMICONDUCTOR PACKAGE INTERPOSER HAVING ENCAPSULATED INTERCONNECTS

SMALL FORM FACTOR SOCKETS AND CONNECTORS

CABLE CONNECTOR

INTERCONNECT ARCHITECTURE WITH STACKED FLEX CABLE

MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS

INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR

DOUBLE-MATED EDGE FINGER CONNECTOR

FLEXIBLE PACKAGE-TO-SOCKET INTERPOSER

INTEGRATED CIRCUIT CONNECTORS

INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR

INTERCONNECT ARCHITECTURE WITH STACKED FLEX CABLE

CONNECTOR ASSEMBLY WITH INTEGRATED PITCH TRANSLATION

CHIP PACKAGE CONNECTOR ASSEMBLY

HELICOIL SPRING BACKING SOCKET

FLEXIBLE PACKAGE-TO-SOCKET INTERPOSER

SOCKET THAT ENGAGES A PIN GRID ARRAY

Electronic assembly with integrated IO and power contacts

Attaching heat sinks to printed circuit boards using preloaded spri...