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Donald W. Brouillette
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St. Albans, VT, US
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Patents Grants
last 30 patents
Information
Patent Grant
Ultraviolet energy curable tape and method of making a semiconducto...
Patent number
8,163,602
Issue date
Apr 24, 2012
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultraviolet energy curable tape and method of making a semiconducto...
Patent number
7,902,682
Issue date
Mar 8, 2011
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer front side protection
Patent number
7,288,465
Issue date
Oct 30, 2007
International Business Machines Corpoartion
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer thickness control during backside grind
Patent number
7,134,933
Issue date
Nov 14, 2006
International Business Machines Corporation
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of photoresist in substrate vias during backside grind
Patent number
7,074,715
Issue date
Jul 11, 2006
International Business Machines Corporation
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer front side protection
Patent number
7,001,827
Issue date
Feb 21, 2006
International Business Machines Corporation
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and system for dicing wafers, and semiconductor structures i...
Patent number
6,915,795
Issue date
Jul 12, 2005
International Business Machines Corporation
Donald W. Brouillette
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer thickness control during backside grind
Patent number
6,887,126
Issue date
May 3, 2005
International Business Machines Corporation
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of photoresist in substrate vias during backside grind
Patent number
6,888,223
Issue date
May 3, 2005
International Business Machines Corporation
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and package including a chip having chamfer...
Patent number
6,600,213
Issue date
Jul 29, 2003
International Business Machines Corporation
Donald W. Brouillette
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer thickness control during backside grind
Patent number
6,368,881
Issue date
Apr 9, 2002
International Business Machines Corporation
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of controlling stress in a film
Patent number
6,328,794
Issue date
Dec 11, 2001
International Business Machines Corporation
Donald Walter Brouillette
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method and system for dicing wafers, and semiconductor structures i...
Patent number
6,271,102
Issue date
Aug 7, 2001
International Business Machines Corporation
Donald W. Brouillette
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Method and apparatus for preventing chip breakage during semiconduc...
Patent number
6,171,873
Issue date
Jan 9, 2001
International Business Machines Corporation
Ronald Lee Mendelson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for mounting wafer frame at back side grinding (BSG) tool
Patent number
6,153,536
Issue date
Nov 28, 2000
International Business Machines Corporation
Donald W. Brouillette
B24 - GRINDING POLISHING
Information
Patent Grant
Method of controlling stress in a film
Patent number
5,913,125
Issue date
Jun 15, 1999
International Business Machines Corporation
Donald Walter Brouillette
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method and apparatus for preventing chip breakage during semiconduc...
Patent number
5,888,838
Issue date
Mar 30, 1999
International Business Machines Corporation
Ronald Lee Mendelson
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ULTRAVIOLET ENERGY CURABLE TAPE AND METHOD OF MAKING A SEMICONDUCTO...
Publication number
20110115072
Publication date
May 19, 2011
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER FRONT SIDE PROTECTION
Publication number
20080064185
Publication date
Mar 13, 2008
International Business Machines Corporation
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor wafer front side protection
Publication number
20050202678
Publication date
Sep 15, 2005
International Business Machines Corporation
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer thickness control during backside grind
Publication number
20050158889
Publication date
Jul 21, 2005
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ultraviolet energy curable tape and method of making a semiconducto...
Publication number
20050104147
Publication date
May 19, 2005
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Use of photoresist in substrate vias during backside grind
Publication number
20050090110
Publication date
Apr 28, 2005
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor wafer front side protection
Publication number
20040209444
Publication date
Oct 21, 2004
International Business Machines Corporation
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Use of photoresist in substrate vias during backside grind
Publication number
20040198021
Publication date
Oct 7, 2004
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and system for dicing wafers, and semiconductor structures i...
Publication number
20030211707
Publication date
Nov 13, 2003
Donald W. Brouillette
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of reducing wafer stress by laser ablation of streets
Publication number
20020086137
Publication date
Jul 4, 2002
International Business Machines Corporation
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer thickness control during backside grind
Publication number
20020048901
Publication date
Apr 25, 2002
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS