Donald W. Dahringer

Person

Glen Ridge, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive adhesive bonding means
- Patent number 5,741,430
- Issue date Apr 21, 1998
- Lucent Technologies Inc.
- Donald William Dahringer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for protecting electronic circuit components
- Patent number 5,689,878
- Issue date Nov 25, 1997
- Lucent Technologies Inc.
- Donald William Dahringer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for solder-bonding contact pad arrays
- Patent number 5,667,132
- Issue date Sep 16, 1997
- Lucent Technologies Inc.
- Leo Maria Freishyn Chirovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated composite semiconductor devices and method for manufactu...
- Patent number 5,578,162
- Issue date Nov 26, 1996
- Lucent Technologies Inc.
- Lucian A. D'Asaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded plastic packaging of electronic devices
- Patent number 5,548,087
- Issue date Aug 20, 1996
- AT&T Corp.
- Donald W. Dahringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount assembly of devices using AdCon interconnections
- Patent number 5,365,656
- Issue date Nov 22, 1994
- AT&T Corp.
- Donald W. Dahringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit elements dependent on core inductance and fabrication thereof
- Patent number 5,257,000
- Issue date Oct 26, 1993
- AT&T Bell Laboratories
- Robert L. Billings
- H01 - BASIC ELECTRIC ELEMENTS

Donald W. Dahringer

Person

Patents Grantslast 30 patents

Conductive adhesive bonding means

Method for protecting electronic circuit components

Method for solder-bonding contact pad arrays

Integrated composite semiconductor devices and method for manufactu...

Molded plastic packaging of electronic devices

Surface mount assembly of devices using AdCon interconnections

Circuit elements dependent on core inductance and fabrication thereof