Donald W. Henderson

Person

Ithaca, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,910,853
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,493,746
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having i...
- Patent number 8,314,500
- Issue date Nov 20, 2012
- Ultratech, Inc.
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modification of solder alloy compositions to suppress interfacial v...
- Patent number 8,157,158
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection for flip-chip using lead-free solders and having im...
- Patent number 7,932,169
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
- Patent number 7,784,669
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to accommodate increase in volume expansion during solder re...
- Patent number 7,703,199
- Issue date Apr 27, 2010
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
- Patent number 7,703,661
- Issue date Apr 27, 2010
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball limiting metallurgy, interconnection structure including the s...
- Patent number 7,273,803
- Issue date Sep 25, 2007
- International Business Machines Corporation
- Yu-Ting Cheng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of accommodating in volume expansion during solder reflow
- Patent number 7,086,147
- Issue date Aug 8, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluidic cooling systems and methods for electronic components
- Patent number 7,079,393
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder protective coating and fluxless joining of flip chip devices...
- Patent number 6,921,015
- Issue date Jul 26, 2005
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free tin-silver-copper alloy solder composition
- Patent number 6,805,974
- Issue date Oct 19, 2004
- International Business Machines Corporation
- Won K. Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure to accommodate increase in volume expansion during solder...
- Patent number 6,686,664
- Issue date Feb 3, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Negative volume expansion lead-free electrical connection
- Patent number 6,649,833
- Issue date Nov 18, 2003
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Punch actuator monitoring system and method
- Patent number 6,598,505
- Issue date Jul 29, 2003
- International Business Machines Corporation
- Donald W. Henderson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder protective coating and fluxless joining of flip chip devices...
- Patent number 6,585,150
- Issue date Jul 1, 2003
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux composition and soldering method for high density arrays
- Patent number 6,550,667
- Issue date Apr 22, 2003
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition for increasing activity of a no-clean flux
- Patent number 6,468,363
- Issue date Oct 22, 2002
- International Business Machines Corporation
- Donald W. Henderson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Punch actuator monitoring system and method
- Patent number 6,305,258
- Issue date Oct 23, 2001
- International Business Machines Corporation
- Donald W. Henderson
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Composition for increasing activity of a no-clean flux
- Patent number 6,217,671
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Donald W. Henderson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anode container, electroplating system, method and plated object
- Patent number 6,190,530
- Issue date Feb 20, 2001
- International Business Machines Corporation
- William Louis Brodsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System and method for transporting and clamping flexible film struc...
- Patent number 6,024,266
- Issue date Feb 15, 2000
- International Business Machines Corporation
- Edward Frank Helinski
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
System and method for transporting and clamping flexible film struc...
- Patent number 5,957,360
- Issue date Sep 28, 1999
- International Business Machines Corporation
- Edward Frank Helinski
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method and apparatus for establishing a solder bond to a solder bal...
- Patent number 5,902,495
- Issue date May 11, 1999
- International Business Machines Corporation
- Edward J. Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting implement and method of making same
- Patent number 4,534,827
- Issue date Aug 13, 1985
- Donald W. Henderson
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20130284495
- Publication date Oct 31, 2013
- Charles L. Arvin
- B82 - NANO-TECHNOLOGY
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20120205425
- Publication date Aug 16, 2012
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20120201596
- Publication date Aug 9, 2012
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20100200271
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
- Publication number 20100155456
- Publication date Jun 24, 2010
- International Business Machines Corp.
- GARETH G. HOUGHAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection for flip-chip using lead-free solders and having im...
- Publication number 20100062597
- Publication date Mar 11, 2010
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...
- Publication number 20090197103
- Publication date Aug 6, 2009
- Da-Yuan Shih
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...
- Publication number 20090197114
- Publication date Aug 6, 2009
- Da-Yuan Shih
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
- Publication number 20080290142
- Publication date Nov 27, 2008
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20080182124
- Publication date Jul 31, 2008
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...
- Publication number 20080157395
- Publication date Jul 3, 2008
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Limiting Metallurgy, Interconnection Structure Including the S...
- Publication number 20080008900
- Publication date Jan 10, 2008
- Yu-Ting Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20060208030
- Publication date Sep 21, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUIDIC COOLING SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS
- Publication number 20060104031
- Publication date May 18, 2006
- International Business Machines Corporation
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball limiting metallurgy, interconnection structure including the s...
- Publication number 20050118437
- Publication date Jun 2, 2005
- International Business Machines Corporation
- Yu-Ting Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY
- Publication number 20050104208
- Publication date May 19, 2005
- International Business Machines Corporation
- James C. Bartelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20040183094
- Publication date Sep 23, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder protective coating and fluxless joining of flip chip devices...
- Publication number 20030178473
- Publication date Sep 25, 2003
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free tin-silver-copper alloy solder composition
- Publication number 20030156969
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Won K. Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20020158110
- Publication date Oct 31, 2002
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flux composition and soldering method for high density arrays
- Publication number 20020063146
- Publication date May 30, 2002
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composition for increasing activity of a no-clean flux
- Publication number 20010025673
- Publication date Oct 4, 2001
- Donald W. Henderson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Punch actuator monitoring system and method
- Publication number 20010006016
- Publication date Jul 5, 2001
- Donald W. Henderson
- G05 - CONTROLLING REGULATING

Donald W. Henderson

Person

Patents Grantslast 30 patents

Additives for grain fragmentation in Pb-free Sn-based solder

Additives for grain fragmentation in Pb-free Sn-based solder

Interconnections for flip-chip using lead-free solders and having i...

Modification of solder alloy compositions to suppress interfacial v...

Interconnection for flip-chip using lead-free solders and having im...

Method and process for reducing undercooling in a lead-free tin-ric...

Method to accommodate increase in volume expansion during solder re...

Method and process for reducing undercooling in a lead-free tin-ric...

Ball limiting metallurgy, interconnection structure including the s...

Method of accommodating in volume expansion during solder reflow

Fluidic cooling systems and methods for electronic components

Solder protective coating and fluxless joining of flip chip devices...

Lead-free tin-silver-copper alloy solder composition

Structure to accommodate increase in volume expansion during solder...

Negative volume expansion lead-free electrical connection

Punch actuator monitoring system and method

Solder protective coating and fluxless joining of flip chip devices...

Flux composition and soldering method for high density arrays

Composition for increasing activity of a no-clean flux

Punch actuator monitoring system and method

Composition for increasing activity of a no-clean flux

Anode container, electroplating system, method and plated object

System and method for transporting and clamping flexible film struc...

System and method for transporting and clamping flexible film struc...

Method and apparatus for establishing a solder bond to a solder bal...

Cutting implement and method of making same

Patents Applicationslast 30 patents

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...

Interconnection for flip-chip using lead-free solders and having im...

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...

METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...

Ball Limiting Metallurgy, Interconnection Structure Including the S...

Structure to accommodate increase in volume expansion during solder...

FLUIDIC COOLING SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS

Ball limiting metallurgy, interconnection structure including the s...

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Structure to accommodate increase in volume expansion during solder...

Solder protective coating and fluxless joining of flip chip devices...

Lead-free tin-silver-copper alloy solder composition

Structure to accommodate increase in volume expansion during solder...

Flux composition and soldering method for high density arrays

Composition for increasing activity of a no-clean flux

Punch actuator monitoring system and method