Dong-hyeok AN

Person

Daegu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Terminal, cloud apparatus, driving method of terminal, method for p...
- Patent number 11,228,653
- Issue date Jan 18, 2022
- Samsung Electronics Co., Ltd.
- Young Yoon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,674,610
- Issue date Jun 2, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for providing service via application
- Patent number 10,613,845
- Issue date Apr 7, 2020
- Samsung Electronics Co., Ltd.
- Dong-hyeok An
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,602,616
- Issue date Mar 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,368,445
- Issue date Jul 30, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for providing service via application
- Patent number 9,971,586
- Issue date May 15, 2018
- Samsung Electronics Co., Ltd.
- Dong-hyeok An
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 9,743,529
- Issue date Aug 22, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and method of manufacturing th...
- Patent number 9,674,968
- Issue date Jun 6, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ha Il Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a rigid-flexible printed circuit board
- Patent number 9,338,899
- Issue date May 10, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing rigid-flexible printed circuit board
- Patent number 8,631,567
- Issue date Jan 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 8,558,116
- Issue date Oct 15, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for location update in mobile communication sy...
- Patent number 8,515,455
- Issue date Aug 20, 2013
- Samsung Electronics Co., Ltd.
- Dong-Hwan An
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for multi-party call in mobile station
- Patent number 8,175,637
- Issue date May 8, 2012
- Samsung Electronics Co., Ltd.
- Dong Hyuk An
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of fabricating rigid-flexible printed circuit board
- Patent number 7,281,328
- Issue date Oct 16, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20200187362
- Publication date Jun 11, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20190297730
- Publication date Sep 26, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR PROVIDING SERVICE VIA APPLICATION
- Publication number 20180217826
- Publication date Aug 2, 2018
- Samsung Electronics Co., Ltd.
- Dong-hyeok AN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20170118833
- Publication date Apr 27, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL, CLOUD APPARATUS, DRIVING METHOD OF TERMINAL, METHOD FOR P...
- Publication number 20160226985
- Publication date Aug 4, 2016
- Samsung Electronics Co., Ltd.
- Young YOON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM AND METHOD FOR PROVIDING SERVICE VIA APPLICATION
- Publication number 20160085536
- Publication date Mar 24, 2016
- Samsung Electronics Co., Ltd.
- Dong-hyeok AN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20160037624
- Publication date Feb 4, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kyung-Chul Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...
- Publication number 20150319844
- Publication date Nov 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Ha Il KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...
- Publication number 20150189735
- Publication date Jul 2, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Chul Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...
- Publication number 20140096383
- Publication date Apr 10, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUI...
- Publication number 20140021164
- Publication date Jan 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20140008107
- Publication date Jan 9, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR LOCATION UPDATE IN MOBILE COMMUNICATION SY...
- Publication number 20120178474
- Publication date Jul 12, 2012
- Samsung Electronics Co., Ltd.
- Dong-Hwan An
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multilayer rigid flexible printed circuit board and method for manu...
- Publication number 20110094776
- Publication date Apr 28, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20100162562
- Publication date Jul 1, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroless nickel plating solution composition, flexible printed c...
- Publication number 20100155108
- Publication date Jun 24, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Chul Min Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE HAVING ELECTROMAGNETIC SHIELDING MEMBER
- Publication number 20100147563
- Publication date Jun 17, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Young Po Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and System for Call Switching During Multi-Party Calling
- Publication number 20100015964
- Publication date Jan 21, 2010
- Samsung Electronics Co., Ltd.
- Dong Hyuk An
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MULTI-PARTY CALL IN MOBILE STATION
- Publication number 20090137234
- Publication date May 28, 2009
- Samsung Electronics Co. Ltd.
- Dong Hyuk AN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of manufacturing printed circuit board for semiconductor pac...
- Publication number 20080257742
- Publication date Oct 23, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rigid-flexible printed circuit board and method of manufacturing th...
- Publication number 20080014768
- Publication date Jan 17, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for plating printed circuit board and printed circuit board...
- Publication number 20070104929
- Publication date May 10, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Kyu Hyok Yim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of fabricating rigid-flexible printed circuit board
- Publication number 20060101640
- Publication date May 18, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Alloy plating solution for surface treatment of modular printed cir...
- Publication number 20030194485
- Publication date Oct 16, 2003
- Byoung-Ho Rhee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Dong-hyeok AN

Person

Patents Grantslast 30 patents

Terminal, cloud apparatus, driving method of terminal, method for p...

Multilayer rigid flexible printed circuit board and method for manu...

System and method for providing service via application

Multilayer rigid flexible printed circuit board and method for manu...

Multilayer rigid flexible printed circuit board and method for manu...

System and method for providing service via application

Multilayer rigid flexible printed circuit board and method for manu...

Rigid flexible printed circuit board and method of manufacturing th...

Method of manufacturing a rigid-flexible printed circuit board

Method of manufacturing rigid-flexible printed circuit board

Multilayer rigid flexible printed circuit board and method for manu...

Method and apparatus for location update in mobile communication sy...

Method for multi-party call in mobile station

Method of fabricating rigid-flexible printed circuit board

Patents Applicationslast 30 patents

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

SYSTEM AND METHOD FOR PROVIDING SERVICE VIA APPLICATION

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

TERMINAL, CLOUD APPARATUS, DRIVING METHOD OF TERMINAL, METHOD FOR P...

SYSTEM AND METHOD FOR PROVIDING SERVICE VIA APPLICATION

FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...

RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...

METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUI...

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

METHOD AND APPARATUS FOR LOCATION UPDATE IN MOBILE COMMUNICATION SY...

Multilayer rigid flexible printed circuit board and method for manu...

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

Electroless nickel plating solution composition, flexible printed c...

SUBSTRATE HAVING ELECTROMAGNETIC SHIELDING MEMBER

Method and System for Call Switching During Multi-Party Calling

METHOD FOR MULTI-PARTY CALL IN MOBILE STATION

Method of manufacturing printed circuit board for semiconductor pac...

Rigid-flexible printed circuit board and method of manufacturing th...

Method for plating printed circuit board and printed circuit board...

Method of fabricating rigid-flexible printed circuit board

Alloy plating solution for surface treatment of modular printed cir...