Dong Pil Jung

Follow

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip scale package and method for manufacturing the same
- Patent number 7,833,837
- Issue date Nov 16, 2010
- Advanced Semiconductor Engineering, Inc.
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method
- Patent number 7,700,411
- Issue date Apr 20, 2010
- Advanced Semiconductor Engineering, Inc.
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 7,633,170
- Issue date Dec 15, 2009
- Advanced Semiconductor Engineering, Inc.
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having passive component disposed between sem...
- Patent number 7,166,917
- Issue date Jan 23, 2007
- Advanced Semiconductor Engineering Inc.
- Jun Young Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20080174013
- Publication date Jul 24, 2008
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- Publication number 20080061407
- Publication date Mar 13, 2008
- Integrated System Solution Advanced Semiconductor Engineering, Inc.
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080032452
- Publication date Feb 7, 2008
- Advanced Semiconductor Engineering, Inc.
- Jun Young YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package and method for manufacturing the same
- Publication number 20060170096
- Publication date Aug 3, 2006
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20060145339
- Publication date Jul 6, 2006
- Jun Young Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device package and manufacturing method thereof
- Publication number 20060145361
- Publication date Jul 6, 2006
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS