Dong-Soo Bang

Person

Suwon-shi, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 12,187,603
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,009,289
- Issue date Jun 11, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,742,300
- Issue date Aug 29, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 11,572,269
- Issue date Feb 7, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,355,451
- Issue date Jun 7, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,152,296
- Issue date Oct 19, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,004,801
- Issue date May 11, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 10,822,226
- Issue date Nov 3, 2020
- Amkor Technology, Inc.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,144,634
- Issue date Dec 4, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,032,705
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,809,446
- Issue date Nov 7, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,056,765
- Issue date Jun 16, 2015
- Jong Dae Jung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wavelength locked integrated optical source structure using multipl...
- Patent number 6,798,799
- Issue date Sep 28, 2004
- Samsung Electronics Co., Ltd.
- Dong-Hoon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed feedback semiconductor laser
- Patent number 6,771,681
- Issue date Aug 3, 2004
- Samsung Electronics Co., Ltd.
- Dong-Soo Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating avalanche photodiode
- Patent number 6,492,239
- Issue date Dec 10, 2002
- Samsung Electronic Co, Ltd.
- Seung-Kee Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser diode array and manufacturing method thereof
- Patent number 5,163,064
- Issue date Nov 10, 1992
- Samsung Electronics Co., Ltd.
- Jong R. Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230369240
- Publication date Nov 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20230257257
- Publication date Aug 17, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220302044
- Publication date Sep 22, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220051973
- Publication date Feb 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210066206
- Publication date Mar 4, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210066204
- Publication date Mar 4, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20210047172
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180350734
- Publication date Dec 6, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180057353
- Publication date Mar 1, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170320723
- Publication date Nov 9, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170018493
- Publication date Jan 19, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Manufacturing Method Thereof
- Publication number 20150274511
- Publication date Oct 1, 2015
- Amkor Technology, Inc.
- Jong Dae Jung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140017843
- Publication date Jan 16, 2014
- Jong Dae Jung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Distributed feedback semiconductor laser
- Publication number 20030072346
- Publication date Apr 17, 2003
- Dong-Soo Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wavelength locked integrated optical source structure using multipl...
- Publication number 20020196821
- Publication date Dec 26, 2002
- Dong-Hoon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating avalanche photodiode
- Publication number 20020001911
- Publication date Jan 3, 2002
- SAMSUNG ELECTRONIC CO., LTD
- Seung-Kee Yang
- H01 - BASIC ELECTRIC ELEMENTS

Dong-Soo Bang

Person

Patents Grantslast 30 patents

Semiconductor package using a polymer substrate

Semiconductor package and manufacturing method thereof

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package using a polymer substrate

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package and manufacturing method thereof

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package using a polymer substrate

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Wavelength locked integrated optical source structure using multipl...

Distributed feedback semiconductor laser

Method for fabricating avalanche photodiode

Laser diode array and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Package And Manufacturing Method Thereof

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Distributed feedback semiconductor laser

Wavelength locked integrated optical source structure using multipl...

Method for fabricating avalanche photodiode