Dong Soon Lim

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable memory timing
- Patent number 12,176,061
- Issue date Dec 24, 2024
- Micron Technology, Inc.
- Kang-Yong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and associated methods with antennas and EMI...
- Patent number 12,148,711
- Issue date Nov 19, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Equalization for pulse-amplitude modulation
- Patent number 12,021,668
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- Kang-Yong Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked semiconductors die assemblies
- Patent number 11,948,921
- Issue date Apr 2, 2024
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable memory timing
- Patent number 11,894,099
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Kang-Yong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic device assemblies and packages and related methods
- Patent number 11,456,284
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods...
- Patent number 11,410,973
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including surface mo...
- Patent number 11,393,794
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,362,070
- Issue date Jun 14, 2022
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and associated methods with antennas and EMI...
- Patent number 11,177,222
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...
- Publication number 20250038127
- Publication date Jan 30, 2025
- Lodestar Licensing Group, LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Equalization for Pulse-Amplitude Modulation
- Publication number 20240323062
- Publication date Sep 26, 2024
- Micron Technology, Inc.
- Kang-Yong Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...
- Publication number 20240186295
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Memory Timing
- Publication number 20240161796
- Publication date May 16, 2024
- Micron Technology, Inc.
- Kang-Yong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS
- Publication number 20230008292
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20220375902
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...
- Publication number 20220302090
- Publication date Sep 22, 2022
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Memory Timing
- Publication number 20220206717
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Kang-Yong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Equalization for Pulse-Amplitude Modulation
- Publication number 20220209998
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Kang-Yong Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...
- Publication number 20220068837
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...
- Publication number 20210118849
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING SURFACE MO...
- Publication number 20210118851
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20210118852
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS
- Publication number 20210118850
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...
- Publication number 20210035917
- Publication date Feb 4, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FOR A MULTI-DIE PACKAGE
- Publication number 20200075548
- Publication date Mar 5, 2020
- Micron Technology, Inc.
- Kang-Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Dong Soon Lim

Person

Patents Grantslast 30 patents

Methods of forming microelectronic device assemblies and packages

Programmable memory timing

Semiconductor packages and associated methods with antennas and EMI...

Equalization for pulse-amplitude modulation

Microelectronic device assemblies and packages including multiple d...

Methods of forming stacked semiconductors die assemblies

Programmable memory timing

Microelectronic device assemblies and packages and related methods

Microelectronic device assemblies and packages and related methods...

Microelectronic device assemblies and packages including surface mo...

Microelectronic device assemblies and packages including multiple d...

Semiconductor packages and associated methods with antennas and EMI...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...

Equalization for Pulse-Amplitude Modulation

MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...

Programmable Memory Timing

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...

Programmable Memory Timing

Equalization for Pulse-Amplitude Modulation

SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING SURFACE MO...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...

INTERCONNECTS FOR A MULTI-DIE PACKAGE